Inventor · disambiguated record
Kazuaki Kubo
Also filed as: KUBO KAZUAKI
16 granted patents·1 pending application·334 citations·filing 1995–2018
94Inventor score
Files withSEIKO INSTR INC5MITSUBISHI MATERIALS CORP4RENESAS ELECTRONICS CORP4RENESAS TECH CORP2NAGASE TOSHIYUKI1
Top patents by PatentIndex Score
17 records- 0191US6310775B1Power module substrateMITSUBISHI MATERIALS CORP·Filed 2000·Granted Oct 30, 2001·82 cites·6 claims
- 0290US7532481B2Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint materialMITSUBISHI MATERIALS CORP·Filed 2005·Granted May 12, 2009·17 cites·6 claims
- 0389US7016231B2Nonvolatile memoryRENESAS TECH CORP·Filed 2004·Granted Mar 21, 2006·46 cites·5 claims
- 0482US6306709B1Semiconductor device and manufacturing method thereofSEIKO INSTR INC·Filed 1999·Granted Oct 23, 2001·58 cites·5 claims
- 0580US8164909B2Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint materialNAGASE TOSHIYUKI·Filed 2010·Granted Apr 24, 2012·6 cites·3 claims
- 0672US10879692B2Semiconductor device and electronic control system having the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 29, 2020·2 cites·17 claims
- 0772US10176913B2Semiconductor device, in-vehicle valve system and solenoid driverRENESAS ELECTRONICS CORP·Filed 2016·Granted Jan 8, 2019·2 cites·12 claims
- 0870US6483185B1Power module substrate, method of producing the same, and semiconductor device including the substrateMITSUBISHI MATERIALS CORP·Filed 1999·Granted Nov 19, 2002·44 cites·9 claims
- 0966US10910136B2Semiconductor device, in-vehicle valve system and solenoid driverRENESAS ELECTRONICS CORP·Filed 2018·Granted Feb 2, 2021·0 cites·3 claims
- 1063US6498376B1Semiconductor device and manufacturing method thereofSEIKO INSTR INC·Filed 1995·Granted Dec 24, 2002·26 cites·28 claims
- 1157US8093762B2Semiconductor integrated circuit deviceTAKAI KAZUYOSHI·Filed 2011·Granted Jan 10, 2012·2 cites·21 claims
- 1257US5793674ASemiconductor integrated circuit device, manufacturing method thereof, and driving method for the sameSEIKO INSTR INC·Filed 1995·Granted Aug 11, 1998·33 cites·49 claims
- 1352US7366019B2Nonvolatile memoryRENESAS TECH CORP·Filed 2006·Granted Apr 29, 2008·2 cites·5 claims
- 1452US2008248326A1Ai/ain joint material, base plate for power module, power module, and manufacturing method of ai/ain joint materialMITSUBISHI MATERIALS CORP·Filed 2008·Application pending·0 cites
- 1547US6515932B1Memory circuitSEIKO INSTR INC·Filed 2000·Granted Feb 4, 2003·5 cites·22 claims
- 1643US7989988B2Semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2006·Granted Aug 2, 2011·1 cites·21 claims
- 1742US5808934AIntegrated logic circuit and EEPROMSEIKO INSTR INC·Filed 1995·Granted Sep 15, 1998·8 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →