Inventor · disambiguated record
Kazuhiko Kurafuchi
Also filed as: KURAFUCHI KAZUHIKO
22 granted patents·4 pending applications·139 citations·filing 1993–2024
94Inventor score
Files withHITACHI CHEMICAL CO LTD12RESONAC CORP5MITSUBISHI ELECTRIC CORP4SHOWA DENKO MATERIALS CO LTD4KURAFUCHI KAZUHIKO1
Top patents by PatentIndex Score
26 records- 0193US11979990B2Wiring board and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted May 7, 2024·3 cites·14 claims
- 0290US12004305B2Wiring board and production method for sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 4, 2024·2 cites·13 claims
- 0388US12426164B2Semiconductor packageRESONAC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·8 claims
- 0487US10388608B2Semiconductor device and method for manufacturing sameHITACHI CHEMICAL CO LTD·Filed 2016·Granted Aug 20, 2019·8 cites·19 claims
- 0580US2024282684A1Substrate and method for manufacturing the sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 0678US11990396B2Substrate and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 0778US10363608B2Copper paste for joining, method for producing joined body, and method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jul 30, 2019·3 cites·9 claims
- 0878US6256875B1Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 10, 2001·50 cites·8 claims
- 0973US9661763B2Structure containing conductor circuit, method for manufacturing same, and heat-curable resin compositionHITACHI CHEMICAL CO LTD·Filed 2012·Granted May 23, 2017·4 cites·24 claims
- 1071US10756008B2Organic interposer and method for manufacturing organic interposerHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 25, 2020·1 cites·6 claims
- 1170US11562951B2Organic interposer and method for manufacturing organic interposerHITACHI CHEMICAL CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 1267US10575402B2Resin composition, wiring layer laminate for semiconductor, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 25, 2020·1 cites·17 claims
- 1366US10930612B2Copper paste for pressureless bonding, bonded body and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 23, 2021·1 cites·9 claims
- 1466US6005289APackage for semiconductor device laminated printed circuit boardsMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 21, 1999·30 cites·5 claims
- 1565US11532588B2Copper paste for pressureless bonding, bonded body and semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·7 claims
- 1663US6774501B2Resin-sealed semiconductor device, and die bonding material and sealing material for use thereinHITACHI CHEMICAL CO LTD·Filed 2001·Granted Aug 10, 2004·6 cites·24 claims
- 1760US9075307B2Photosensitive resin composition for protective film of printed wiring board for semiconductor packageKURAFUCHI KAZUHIKO·Filed 2009·Granted Jul 7, 2015·3 cites·9 claims
- 1851US10566304B2Assembly and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Feb 18, 2020·0 cites·9 claims
- 1950US2024088051A1Method for producing semiconductor device, wiring board, and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 2048US5410182AHigh density semiconductor device having inclined chip mountingMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Apr 25, 1995·18 cites·14 claims
- 2148US2023356498A1Organic core material, production method for same, laminate including organic core material, and circuit boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 2246US2023253215A1Method for producing circuit boardRESONAC CORP·Filed 2020·Application pending·0 cites
- 2344US10034384B2Structure containing conductor circuit, method for manufacturing same, and heat-curable resin compositionHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·24 claims
- 2442US10748865B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 18, 2020·0 cites·17 claims
- 2542US5672965AEvaluation board for evaluating electrical characteristics of an IC packageMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Sep 30, 1997·9 cites·12 claims
- 2639US11040416B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Kazuhiko Kurafuchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →