Inventor · disambiguated record
Kah Wai Lau
Also filed as: LAU KAH WAI
1 granted patent·1 pending application·0 citations·filing 2023–2024
10Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0149US12512435B2Semiconductor package having a solder wetting structureINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·23 claims
- 0245US2025183221A1Semiconductor package having a leadframe with a metal-plated bond areaINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kah Wai Lau files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →