Inventor · disambiguated record
Kang-Hua Lee
Also filed as: LEE KANG-HUA
3 granted patents·1 pending application·97 citations·filing 1999–2010
71Inventor score
Technology areasH10P
Top patents by PatentIndex Score
4 records- 0185US6436834B1Chemical-mechanical abrasive composition and methodETERNAL CHEMICAL CO LTD·Filed 2000·Granted Aug 20, 2002·46 cites·14 claims
- 0278US6508952B1Chemical mechanical abrasive composition for use in semiconductor processingETERNAL CHEMICAL CO LTD·Filed 1999·Granted Jan 21, 2003·51 cites·6 claims
- 0337US2003064596A1Method of polishing a semiconductor wafer surfaceETERNAL CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
- 0432US8889553B2Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the methodLEE KANG-HUA·Filed 2010·Granted Nov 18, 2014·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →