Inventor · disambiguated record
Kanggyune Lee
Also filed as: LEE KANGGYUNE
0 granted patents·4 pending applications·0 citations·filing 2023–2024
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0154US2025096148A1Method of marking semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0251US2024105636A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0343US2025078249A1Method of inspecting a mark engraved on a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0442US2025124565A1Semiconductor package mark inspection method and semiconductor device manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →