Inventor · disambiguated record
Kang Lee
Also filed as: LEE KANG · LEE KANG YEUL
4 granted patents·1 pending application·40 citations·filing 1998–2010
73Inventor score
Top patents by PatentIndex Score
5 records- 0182US7781325B2Copper pillar tin bump on semiconductor chip and method of forming the sameHWABACK ENGINEERING CO LTD·Filed 2008·Granted Aug 24, 2010·21 cites·5 claims
- 0261US8332170B2Apparatus and method for detecting arcsLEE KANG·Filed 2010·Granted Dec 11, 2012·2 cites·22 claims
- 0346US6282679B1Pattern and method of metal line package level test for semiconductor deviceLG SEMICON CO LTD·Filed 1998·Granted Aug 28, 2001·16 cites·22 claims
- 0440US6435203B1Apparatus and method for regenerating etchant solution containing metal compoundHWA BAEK ENGINEERING CO LTD·Filed 2000·Granted Aug 20, 2002·1 cites·9 claims
- 0530US2011090503A1Apparatus for detecting arcsLEE KANG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →