Inventor · disambiguated record
Kai-Chih Liang
Also filed as: LIANG KAI-CHIH
25 granted patents·2 pending applications·175 citations·filing 2007–2024
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12TAIWAN SEMICONDUCTOR MFG8CORETRONIC MEMS CORP3LIANG KAI-CHIH3KALNITSKY ALEXANDER1
Top patents by PatentIndex Score
27 records- 0197US9459234B2CMOS compatible BioFETKALNITSKY ALEXANDER·Filed 2012·Granted Oct 4, 2016·21 cites·16 claims
- 0297US9133017B2MEMS structure with adaptable inter-substrate bondTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 15, 2015·49 cites·20 claims
- 0396US8987059B2MEMS devices and methods of forming sameLIANG KAI-CHIH·Filed 2012·Granted Mar 24, 2015·46 cites·20 claims
- 0495US9791406B2CMOS compatible BioFETTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·5 cites·20 claims
- 0592US9910009B2CMOS compatible BioFETTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 6, 2018·3 cites·20 claims
- 0692US8952465B2MEMS devices, packaged MEMS devices, and methods of manufacture thereofLIANG KAI-CHIH·Filed 2012·Granted Feb 10, 2015·10 cites·18 claims
- 0788US8012785B2Method of fabricating an integrated CMOS-MEMS deviceTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Sep 6, 2011·16 cites·20 claims
- 0882US8748205B1MEMS structure with adaptable inter-substrate bondTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jun 10, 2014·5 cites·20 claims
- 0980US9617147B2Dual layer microelectromechanical systems device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·2 cites·20 claims
- 1079US8368152B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 5, 2013·4 cites·20 claims
- 1177US11486854B2CMOS compatible BioFETTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 1, 2022·0 cites·20 claims
- 1277US9006015B2Dual layer microelectromechanical systems device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·2 cites·20 claims
- 1376US8633554B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 21, 2014·3 cites·13 claims
- 1475US7732299B2Process for wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jun 8, 2010·6 cites·20 claims
- 1574US9254997B2CMOS-MEMS integrated flow for making a pressure sensitive transducerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 9, 2016·2 cites·20 claims
- 1670US10520467B2CMOS compatible BioFETTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 1764US11180365B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 1862US8647892B2Inline process control structuresLIANG KAI-CHIH·Filed 2010·Granted Feb 11, 2014·1 cites·12 claims
- 1961US10457550B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·0 cites·20 claims
- 2057US10099919B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 16, 2018·0 cites·21 claims
- 2156US2024365670A1Piezoelectric actuating apparatusCORETRONIC MEMS CORP·Filed 2024·Application pending·0 cites
- 2254US9499396B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims
- 2353US9359194B2MEMS devices, packaged MEMS devices, and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 7, 2016·0 cites·20 claims
- 2451US2023056353A1Micro scanning mirrorCORETRONIC MEMS CORP·Filed 2022·Application pending·0 cites
- 2549US12170214B2Semiconductor device manufacturing system and method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 17, 2024·0 cites·20 claims
- 2648US12274172B2Piezoelectric actuating apparatusCORETRONIC MEMS CORP·Filed 2022·Granted Apr 8, 2025·0 cites·16 claims
- 2747US9449867B2VHF etch barrier for semiconductor integrated microsystemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →