Inventor · disambiguated record
Kang-Yi Lien
Also filed as: LIEN KANG-YI
5 granted patents·7 pending applications·1 citations·filing 2022–2025
65Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12
Top patents by PatentIndex Score
12 records- 0190US11834332B2Bond wave optimization method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·1 cites·20 claims
- 0281US2024383005A1Semiconductor device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0380US12162749B2Bond wave optimization method and deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 0479US2025338516A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0575US2025343182A1Thick redistribution layer featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0674US12491536B2Semiconductor device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·12 claims
- 0773US2024395897A1Semiconductor device and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0871US2025316540A1Method and system for detecting semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0968US12507426B2Semiconductor device and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 1067US12362240B2Method and system for detecting semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1166US2024088074A1Thick redistribution layer featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1253US2023278073A1Semiconductor device with improved dielectric film structure and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →