Inventor · disambiguated record
Kao-Chih Liu
Also filed as: LIU KAO-CHIH
2 granted patents·3 pending applications·0 citations·filing 2023–2025
27Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0170US2025355041A1Interconnect structures in integrated circuit chipsTAIWAN SERNICONDUCTOR MFG COMPANY LID·Filed 2025·Application pending·0 cites
- 0269US12265119B2Repackaging IC chip for fault identificationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 0366US2025231233A1Repackaging ic chip for fault identificationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0463US12219709B2Forming trench in IC chip through multiple trench formation and deposition processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0555US2025185171A1Forming trench in ic chip through multiple trench formation and deposition processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →