Inventor · disambiguated record
Kai-Wei Lo
Also filed as: LO KAI-WEI
4 granted patents·4 pending applications·0 citations·filing 2020–2024
54Inventor score
Top patents by PatentIndex Score
8 records- 0163US2025098116A1Thermally conductive boardTCLAD TECH CORPORATION·Filed 2024·Application pending·0 cites
- 0260US12023893B2Insulated metal substrate and method for manufacturing samePOLYTRONICS TECHNOLOGY CORP·Filed 2021·Granted Jul 2, 2024·0 cites·12 claims
- 0356US11511521B2Insulated metal substrate and method for manufacturing samePOLYTRONICS TECHNOLOGY CORP·Filed 2021·Granted Nov 29, 2022·0 cites·9 claims
- 0454US11044817B2Thermally conductive boardPOLYTRONICS TECHNOLOGY CORP·Filed 2020·Granted Jun 22, 2021·0 cites·12 claims
- 0554US2023249438A1Metal clad substratePOLYTRONICS TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0653US2025042144A1Thermally conductive boardTCLAD TECH CORPORATION·Filed 2024·Application pending·0 cites
- 0750US2024227358A9Thermally conductive boardPOLYTRONICS TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0845US11778739B2Thermally conductive boardPOLYTRONICS TECHNOLOGY CORP·Filed 2021·Granted Oct 3, 2023·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →