Inventor · disambiguated record
Kazuya Maekawa
Also filed as: MAEKAWA KAZUYA
30 granted patents·24 pending applications·153 citations·filing 2000–2024
95Inventor score
Files withTDK CORP25MITSUBOSHI DIAMOND IND CO LTD14MITSUI E & S MACH CO LTD3TAIYO YUDEN KK3HARAGUCHI HIROTAKE2
Top patents by PatentIndex Score
54 records- 0191US7523846B2Scribing method, cutter wheel, scribing device using the cutter wheel, and cutter wheel manufacturing device for manufacturing the cutter wheelMITSUBOSHI DIAMOND IND CO LTD·Filed 2002·Granted Apr 28, 2009·25 cites·17 claims
- 0290US6796212B2Scribing method for brittle materials, a cutter wheel used therefor and an apparatus provided therewithMITSUBOSHI DIAMOND IND CO LTD·Filed 2001·Granted Sep 28, 2004·24 cites·22 claims
- 0389US10886069B2Multilayer ceramic electronic device and circuit board having sameTAIYO YUDEN KK·Filed 2020·Granted Jan 5, 2021·2 cites·24 claims
- 0489US6629484B2Cutter wheel for brittle sheetsMITSUBOSHI DIAMOND IND CO LTD·Filed 2001·Granted Oct 7, 2003·43 cites·17 claims
- 0586US7975588B2Scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus for producing the cutter wheelMITSUBOSHI DIAMOND IND CO LTD·Filed 2009·Granted Jul 12, 2011·6 cites·3 claims
- 0675US7975589B2Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the sameMITSUBOSHI DIAMOND IND CO LTD·Filed 2006·Granted Jul 12, 2011·6 cites·9 claims
- 0773US10629796B2Laminate and thermoelectric conversion elementTDK CORP·Filed 2018·Granted Apr 21, 2020·1 cites·16 claims
- 0868US12492942B2Structure body and electromagnetic wave sensorTDK CORP·Filed 2022·Granted Dec 9, 2025·0 cites·6 claims
- 0968US7851241B2Method for severing brittle material substrate and severing apparatus using the methodMITSUBOSHI DIAMOND IND CO LTD·Filed 2003·Granted Dec 14, 2010·5 cites·57 claims
- 1065US2009126551A1Scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus for producing the cutter wheelMITSUBOSHI DIAMOND IND CO LTD·Filed 2009·Application pending·0 cites
- 1164US6654203B2Thin-film magnetic head and method of manufacturing same, head gimbal assembly and hard disk driveTDK CORP·Filed 2001·Granted Nov 25, 2003·6 cites·8 claims
- 1263US12480817B2Structure body and electromagnetic wave sensorTDK CORP·Filed 2022·Granted Nov 25, 2025·0 cites·8 claims
- 1361US12474215B2Electromagnetic wave sensorTDK CORP·Filed 2022·Granted Nov 18, 2025·0 cites·9 claims
- 1461US11898913B2Electromagnetic wave sensorTDK CORP·Filed 2022·Granted Feb 13, 2024·0 cites·6 claims
- 1561US11090618B1Treatment method of fluid to be treated by zeolite membraneMITSUI E & S MACH CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·6 claims
- 1660US2024363268A1Conductive member and thermistor element using the sameTDK CORP·Filed 2024·Application pending·0 cites
- 1758US11034587B2Method of producing zeolite filmMITSUI E & S MACH CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·4 claims
- 1858US8148878B2Piezoelectric element and gyroscopeMAEKAWA KAZUYA·Filed 2010·Granted Apr 3, 2012·2 cites·7 claims
- 1958US6946994B2Dielectric antennaTAIYO YUDEN KK·Filed 2002·Granted Sep 20, 2005·12 cites·18 claims
- 2057US2024355677A1Method for manufacturing electronic device and electronic deviceTDK CORP·Filed 2024·Application pending·0 cites
- 2155US10941044B2Method of producing zeolite filmMITSUI E & S MACH CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·4 claims
- 2255US2024159591A1Electromagnetic wave sensorTDK CORP·Filed 2023·Application pending·0 cites
- 2354US2024035893A1Element array circuit, electromagnetic wave sensor, temperature sensor, and strain sensorTDK CORP·Filed 2023·Application pending·0 cites
- 2454US2023062983A1Body and electromagnetic wave sensorTDK CORP·Filed 2022·Application pending·0 cites
- 2554US2023296443A1Electromagnetic wave sensor and manufacturing method thereofTDK CORP·Filed 2023·Application pending·0 cites
- 2652US6935014B2Method for fabricating a thin film magnetic headTDK CORP·Filed 2002·Granted Aug 30, 2005·4 cites·20 claims
- 2751US6532647B1Manufacturing method of composite type thin-film magnetic headTDK CORP·Filed 2000·Granted Mar 18, 2003·4 cites·9 claims
- 2851US2011107894A1Brittle Material Substrate Chamfering MethodMITSUBOSHI DIAMOND IND CO LTD·Filed 2009·Application pending·0 cites
- 2950US10984956B2Multilayer ceramic capacitor, package of multilayer ceramic capacitor and component mounting circuit substrateTAIYO YUDEN KK·Filed 2019·Granted Apr 20, 2021·0 cites·7 claims
- 3050US8292142B2Manual breakerHARAGUCHI HIROTAKE·Filed 2008·Granted Oct 23, 2012·1 cites·12 claims
- 3149US8127609B2Angular velocity sensing elementUNNO KEN·Filed 2008·Granted Mar 6, 2012·1 cites·4 claims
- 3248US2020028058A1Thermoelectric conversion deviceTDK CORP·Filed 2019·Application pending·0 cites
- 3348US2011232422A1Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the sameMITSUBOSHI DIAMOND IND CO LTD·Filed 2011·Application pending·0 cites
- 3447US2011113945A1Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the sameMITSUBOSHI DIAMOND IND CO LTD·Filed 2011·Application pending·0 cites
- 3546US8166815B2Angular velocity sensor elementTOCHI KENICHI·Filed 2009·Granted May 1, 2012·0 cites·4 claims
- 3645US2020052178A1Thermoelectric conversion deviceTDK CORP·Filed 2019·Application pending·0 cites
- 3745US2010186239A1Tip holder for manual cutter, and manual cutter having the tip holderHARAGUCHI HIROTAKE·Filed 2008·Application pending·0 cites
- 3843US9257524B2Layered film including heteroepitaxial PN junction oxide thin filmTDK CORP·Filed 2013·Granted Feb 9, 2016·0 cites·9 claims
- 3943US2004123717A1Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheelFiled 2002·Application pending·0 cites
- 4042US2020028055A1Thermoelectric conversion deviceTDK CORP·Filed 2017·Application pending·0 cites
- 4141US2019267531A1Thermoelectric conversion deviceTDK CORP·Filed 2017·Application pending·0 cites
- 4241US2018226559A1Thermoelectric conversion deviceTDK CORP·Filed 2018·Application pending·0 cites
- 4341US2020006614A1Thermoelectric conversion deviceTDK CORP·Filed 2017·Application pending·0 cites
- 4440US9780277B2Thermoelectric deviceTDK CORP·Filed 2015·Granted Oct 3, 2017·0 cites·5 claims
- 4539USD589774SGlass cutterMITSUBOSHI DIAMOND IND CO LTD·Filed 2007·Granted Apr 7, 2009·4 cites·1 claims
- 4639USD589775SGlass cutterMITSUBOSHI DIAMOND IND CO LTD·Filed 2007·Granted Apr 7, 2009·4 cites·1 claims
- 4739US2018287038A1Thermoelectric conversion deviceTDK CORP·Filed 2018·Application pending·0 cites
- 4839US2006042433A1Method and device for scribing fragile material substrateMAEKAWA KAZUYA·Filed 2003·Application pending·0 cites
- 4938US2011095062A1Breaking apparatus and breaking methodMITSUBOSHI DIAMOND IND CO LTD·Filed 2010·Application pending·0 cites
- 5037US2011019216A1Network multifunctional peripheralMURATA MACHINERY LTD·Filed 2010·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →