Inventor · disambiguated record
Kazuhiro Maeno
Also filed as: MAENO KAZUHIRO
12 granted patents·5 pending applications·155 citations·filing 1994–2025
90Inventor score
Top patents by PatentIndex Score
17 records- 0189US7186926B2Surface mounting structure for surface mounting an electronic componentTOYOTA JIDOSHOKKI KK·Filed 2005·Granted Mar 6, 2007·22 cites·7 claims
- 0279US6885097B2Semiconductor deviceTOYOTA JIDOSHOKKI KK·Filed 2001·Granted Apr 26, 2005·29 cites·10 claims
- 0368US6120011AEngine mount structureFUJI HEAVY IND LTD·Filed 1999·Granted Sep 19, 2000·36 cites·17 claims
- 0466US2025346005A1Method for producing sheet prepreg, method for supplying fiber raw material, and sheet prepregMITSUBISHI CHEM CORP·Filed 2025·Application pending·0 cites
- 0564US7495924B2Electronic deviceTOYOTA JIDOSHOKKI KK·Filed 2007·Granted Feb 24, 2009·2 cites·15 claims
- 0664US7161235B2Semiconductor apparatus of a plurality of semiconductor devices enclosed in case and wiring method thereforeTOYOTA JIDOSHOKKI KK·Filed 2002·Granted Jan 9, 2007·13 cites·6 claims
- 0760US6213245B1Cross member structure for transmissionFUJI HEAVY IND LTD·Filed 1999·Granted Apr 10, 2001·24 cites·3 claims
- 0857US5400953AMethod of printing a bonding agentTOYODA AUTOMATIC LOOM WORKS·Filed 1994·Granted Mar 28, 1995·20 cites·7 claims
- 0956US7705474B2Connection structure for connecting flexible printed circuit to main substrate using a potting resin in a through-holeTOYOTA JIDOSHOKKI KK·Filed 2007·Granted Apr 27, 2010·1 cites·3 claims
- 1052US12497201B2Particulate matter filling method and particulate matter filling deviceMITSUBISHI GAS CHEMICAL CO·Filed 2023·Granted Dec 16, 2025·0 cites·10 claims
- 1150US9216478B2Solder and die-bonding structureTOYOTA JIDOSHOKKI KK·Filed 2014·Granted Dec 22, 2015·0 cites·2 claims
- 1250US6664629B2Semiconductor deviceTOYOTA JIDOSHOKKI KK·Filed 2002·Granted Dec 16, 2003·4 cites·6 claims
- 1349US2015259480A1Process for producing acrylonitrile-based polymer solution, shearing device, process for producing acrylonitrile-based fiber, and process for producing carbon fiberMITSUBISHI RAYON CO·Filed 2013·Application pending·0 cites
- 1443US2008316720A1Electronic componentsMAENO KAZUHIRO·Filed 2008·Application pending·0 cites
- 1543US2007207637A1Composite circuit boardTOYOTA JIDOSHOKKI KK·Filed 2007·Application pending·0 cites
- 1640US6941296B2Internet search supporting apparatus and method, and internet search supporting program using the methodFUJITSU LTD·Filed 2002·Granted Sep 6, 2005·4 cites·9 claims
- 1733US2017232562A1Bonding structure, bonding material and bonding methodTOYOTA JIDOSHOKKI KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →