Inventor · disambiguated record
Kajinami Masato
Also filed as: MASATO KAJINAMI
3 granted patents·1 citations·filing 2013–2013
47Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0150US9209051B2Mounting apparatus and mounting method for flip chip bonding semiconductor chips using two-step pressing processSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 8, 2015·1 cites·13 claims
- 0242US9319593B2Recognition apparatus, recognition method, mounting apparatus, and mounting methodSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 19, 2016·0 cites·13 claims
- 0339US9218654B2Apparatus and method of recognizing an object, and apparatus and method of mounting a semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 22, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →