Inventor · disambiguated record
Karumbu Meyyappan
Also filed as: MEYYAPPAN KARUMBU NATHAN · Meyyappan Karumbu
10 granted patents·16 pending applications·6 citations·filing 2015–2024
80Inventor score
Top patents by PatentIndex Score
26 records- 0186US11622466B2Low force liquid metal interconnect solutionsINTEL CORP·Filed 2020·Granted Apr 4, 2023·2 cites·21 claims
- 0280US12230564B2Package substrate z-disaggregation with liquid metal interconnectsINTEL CORP·Filed 2021·Granted Feb 18, 2025·1 cites·25 claims
- 0373US12349303B2Low force liquid metal interconnect solutionsINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0465US12411296B2Reworkable zero-force insertion electrical optical package socket and methodINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·23 claims
- 0565US9859636B2Linear edge connector with activator bar and contact load springINTEL CORP·Filed 2015·Granted Jan 2, 2018·2 cites·19 claims
- 0659US2025309570A1Hybrid socket interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 0759US2025309091A1Liquid metal socket interconnects with pooled wellsINTEL CORP·Filed 2024·Application pending·0 cites
- 0858US2025309571A1Liquid metal socket interconnects with lithographically defined socket contact pinsINTEL CORP·Filed 2024·Application pending·0 cites
- 0957US12506083B2Liquid metal interconnect for modular package server architectureINTEL CORP·Filed 2021·Granted Dec 23, 2025·0 cites·20 claims
- 1057US2025149414A1Low z-height separable liquid metal based electrical interconnectINTEL CORP·Filed 2023·Application pending·0 cites
- 1156US2025079278A1Liquid metal socket interconnects with liquid passivation layer and filler materialsINTEL CORP·Filed 2023·Application pending·0 cites
- 1255US2024404896A1Patch interposer mold design for liquid metal carrier arrayINTEL CORP·Filed 2023·Application pending·0 cites
- 1354US2024388018A1Liquid metal patch interconnect for large warpage componentsINTEL CORP·Filed 2023·Application pending·0 cites
- 1454US2024363520A1Self-healing cap for liquid metal containment in socket applicationsINTEL CORP·Filed 2023·Application pending·0 cites
- 1553US12494435B2Liquid metal interconnect for modular system on an interposer server architectureINTEL CORP·Filed 2021·Granted Dec 9, 2025·0 cites·22 claims
- 1653US10044115B2Universal linear edge connectorINTEL CORP·Filed 2015·Granted Aug 7, 2018·1 cites·7 claims
- 1752US11543454B2Double-beam test probeINTEL CORP·Filed 2018·Granted Jan 3, 2023·0 cites·24 claims
- 1852US2024006400A1Liquid metal based first level interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 1951US2023317619A1Microelectronic structure including die bonding film between embedded die and surface of substrate cavity, and method of making sameINTEL CORP·Filed 2022·Application pending·0 cites
- 2051US2024074046A1Technologies for sealing liquid metal interconnect array packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2150US2023314503A1Technologies for testing liquid metal array interconnect packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2249US2023187850A1Liquid metal connection device and methodINTEL CORP·Filed 2021·Application pending·0 cites
- 2349US2024297119A1Liquid metal connection device and methodINTEL CORP·Filed 2021·Application pending·0 cites
- 2448US2023187337A1Flexible liquid metal connection device and methodMeyyappan Karumbu·Filed 2021·Application pending·0 cites
- 2546US2023317533A1Technologies for liquid metal mixtures for electrical interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 2640US10109940B2Connector port frame for processor packageINTEL CORP·Filed 2016·Granted Oct 23, 2018·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →