Inventor · disambiguated record
Kazuhiko Mitobe
Also filed as: MITOBE KAZUHIKO
9 granted patents·663 citations·filing 1992–2000
92Inventor score
Technology areasH10W
Files withFUJITSU LTD9
Top patents by PatentIndex Score
9 records- 0195US5643831AProcess for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor deviceFUJITSU LTD·Filed 1995·Granted Jul 1, 1997·231 cites·13 claims
- 0294US6433418B1Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanismFUJITSU LTD·Filed 1999·Granted Aug 13, 2002·178 cites·4 claims
- 0386US6025258AMethod for fabricating solder bumps by forming solder balls with a solder ball forming memberFUJITSU LTD·Filed 1995·Granted Feb 15, 2000·94 cites·41 claims
- 0476US6528346B2Bump-forming method using two plates and electronic deviceFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·24 cites·3 claims
- 0571US5747874ASemiconductor device, base member for semiconductor device and semiconductor device unitFUJITSU LTD·Filed 1995·Granted May 5, 1998·37 cites·27 claims
- 0667US6022759AMethod for producing a semiconductor device, base member for semiconductor device and semiconductor device unitFUJITSU LTD·Filed 1998·Granted Feb 8, 2000·31 cites·8 claims
- 0767US5305179ASurface-mounting type semiconductor package having an improved efficiency for heat dissipationFUJITSU LTD·Filed 1992·Granted Apr 19, 1994·39 cites·16 claims
- 0856US6094356ASemiconductor device and semiconductor device moduleFUJITSU LTD·Filed 1998·Granted Jul 25, 2000·21 cites·4 claims
- 0939US5984699AMethod of fabricating a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Nov 16, 1999·8 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →