Inventor · disambiguated record
Kazumi Miyake
Also filed as: MIYAKE KAZUMI
11 granted patents·1 pending application·136 citations·filing 1991–2019
90Inventor score
Files withHONDA MOTOR CO LTD12
Top patents by PatentIndex Score
12 records- 0172US5928601AMethod for producing silicon nitride reaction sintered bodyHONDA MOTOR CO LTD·Filed 1997·Granted Jul 27, 1999·28 cites·2 claims
- 0268US6133180ACeramic composite particle and production method thereofHONDA MOTOR CO LTD·Filed 1998·Granted Oct 17, 2000·20 cites·4 claims
- 0361US5618768ASintered body of silicon nitride and composite sintered body of silicon nitride and silicon carbideHONDA MOTOR CO LTD·Filed 1996·Granted Apr 8, 1997·18 cites·9 claims
- 0459US6261511B1Method for producing ceramic composite particleHONDA MOTOR CO LTD·Filed 2000·Granted Jul 17, 2001·7 cites·6 claims
- 0553US5767025AComposite powder comprising silicon nitride and silicon carbideHONDA MOTOR CO LTD·Filed 1996·Granted Jun 16, 1998·17 cites·3 claims
- 0649US5912200AComposite powder and method of manufacturing sintered body therefromHONDA MOTOR CO LTD·Filed 1997·Granted Jun 15, 1999·15 cites·10 claims
- 0749US5648028AMethod of manufacturing a sintered composite body of silicon nitride and silicon carbideHONDA MOTOR CO LTD·Filed 1995·Granted Jul 15, 1997·15 cites·6 claims
- 0845US5785922AMethod for producing composite sintered body of silicon carbide and silicon nitrideHONDA MOTOR CO LTD·Filed 1995·Granted Jul 28, 1998·9 cites·5 claims
- 0941US10967543B2Resin molding apparatusHONDA MOTOR CO LTD·Filed 2017·Granted Apr 6, 2021·0 cites·16 claims
- 1035US5733498AMethod for producing silicon nitride reaction-sintered bodyHONDA MOTOR CO LTD·Filed 1996·Granted Mar 31, 1998·4 cites·13 claims
- 1134US5158914AMethod of heat-treating silicon nitride sintered bodyHONDA MOTOR CO LTD·Filed 1991·Granted Oct 27, 1992·3 cites·14 claims
- 1234US2019367098A1Structural member for vehicleHONDA MOTOR CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →