Inventor · disambiguated record
Katsumi Mogi
Also filed as: MOGI KATSUMI
4 granted patents·192 citations·filing 1992–1995
81Inventor score
Top patents by PatentIndex Score
4 records- 0188US5531635ATruing apparatus for wafer polishing padMITSUBISHI MATERIALS CORP·Filed 1995·Granted Jul 2, 1996·106 cites·8 claims
- 0274US5657123AFilm thickness measuring apparatus, film thickness measuring method and wafer polishing system measuring a film thickness in conjunction with a liquid tankMITSUBISHI MATERIALS CORP·Filed 1995·Granted Aug 12, 1997·42 cites·10 claims
- 0366US5226404ACutting apparatusMITSUBISHI METAL CORP·Filed 1992·Granted Jul 13, 1993·31 cites·21 claims
- 0446US5209216AChain cutterMITSUBISHI METAL CORP·Filed 1992·Granted May 11, 1993·13 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →