Inventor · disambiguated record
Karsten Moh
Also filed as: MOH KARSTEN
16 granted patents·3 pending applications·27 citations·filing 2008–2021
88Inventor score
Files withFACEBOOK TECH LLC9INNOCISE GMBH3LEIBNIZ INSTITUT FUER NEUE MAT GEMEINNUETZIGE GMBH3DE OLIVEIRA PETER WILLIAM1LIEBERMAN DANIEL1
Top patents by PatentIndex Score
19 records- 0192US10586725B1Method for polymer-assisted chip transferFACEBOOK TECH LLC·Filed 2018·Granted Mar 10, 2020·8 cites·20 claims
- 0291US10326040B1Washable mold for conformable layer formation on semiconductor devicesFACEBOOK TECH LLC·Filed 2018·Granted Jun 18, 2019·7 cites·19 claims
- 0389US11145797B1Forming conformable layer with flap on semiconductor devicesFACEBOOK TECH LLC·Filed 2019·Granted Oct 12, 2021·6 cites·20 claims
- 0484US11655396B2Double-sided reversible adhesive structureLEIBNIZ INSTITUT FUER NEUE MAT GEMEINNUETZIGE GMBH·Filed 2018·Granted May 23, 2023·1 cites·16 claims
- 0578US10910514B1Molded etch masksFACEBOOK TECH LLC·Filed 2018·Granted Feb 2, 2021·2 cites·18 claims
- 0677US10323324B2Method for producing patterned metallic coatingsLEIBNIZ INSTITUT FUER NEUE MAT GEMEINNUETZIGE GMBH·Filed 2014·Granted Jun 18, 2019·2 cites·7 claims
- 0768US12068443B1Forming conformable layer with flap on semiconductor devicesMETA PLATFORMS TECH LLC·Filed 2021·Granted Aug 20, 2024·0 cites·19 claims
- 0868US10964867B2Using underfill or flux to promote placing and parallel bonding of light emitting diodesFACEBOOK TECH LLC·Filed 2019·Granted Mar 30, 2021·1 cites·13 claims
- 0961US12024656B2Moulded body comprising a structured surface for controlled adhesionINNOCISE GMBH·Filed 2021·Granted Jul 2, 2024·0 cites·13 claims
- 1058US11787982B2Structure with improved adhesionINNOCISE GMBH·Filed 2018·Granted Oct 17, 2023·0 cites·19 claims
- 1156US2021210667A1Using underfill or flux to promote placing and parallel bonding of light emitting diodesFACEBOOK TECH LLC·Filed 2021·Application pending·0 cites
- 1253US10822697B2Method for producing metal structuresDE OLIVEIRA PETER WILLIAM·Filed 2011·Granted Nov 3, 2020·0 cites·14 claims
- 1349US11873849B2Shaped body having a structured surface for reversible adhesionINNOCISE GMBH·Filed 2018·Granted Jan 16, 2024·0 cites·21 claims
- 1446US10388516B1Method for polymer-assisted chip transferFACEBOOK TECH LLC·Filed 2018·Granted Aug 20, 2019·0 cites·17 claims
- 1544US10763135B2Integrated elastomeric interface layer formation and singulation for light emitting diodesFACEBOOK TECH LLC·Filed 2018·Granted Sep 1, 2020·0 cites·20 claims
- 1644US2013236708A1Process for Producing Metallic StructuresMOH KARSTEN·Filed 2011·Application pending·0 cites
- 1743US10559486B1Method for polymer-assisted chip transferFACEBOOK TECH LLC·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 1842US10941035B2Method for producing structured surfacesLEIBNIZ INSTITUT FUER NEUE MAT GEMEINNUETZIGE GMBH·Filed 2016·Granted Mar 9, 2021·0 cites·13 claims
- 1941US2009269510A1Printed electronics by metal plating through uv lightLIEBERMAN DANIEL·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →