Inventor · disambiguated record
Katsuhito Mori
Also filed as: MORI KATSUHITO
7 granted patents·2 pending applications·14 citations·filing 2011–2022
77Inventor score
Top patents by PatentIndex Score
9 records- 0190US10385076B2Surface treatment agent and novel compoundMORI KUNIO·Filed 2017·Granted Aug 20, 2019·8 cites·1 claims
- 0284US9790242B2Surface treatment method, surface treatment agent, and novel compoundMORI KUNIO·Filed 2012·Granted Oct 17, 2017·5 cites·7 claims
- 0365US9540403B2Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compoundMORI KUNIO·Filed 2015·Granted Jan 10, 2017·0 cites·4 claims
- 0462US8753748B2Process for forming metal film, and product equipped with metal filmMORI KUNIO·Filed 2011·Granted Jun 17, 2014·0 cites·30 claims
- 0561US12221565B2Bonded structureDENSO CORP·Filed 2022·Granted Feb 11, 2025·0 cites·10 claims
- 0660US9593423B2Process for forming metal film, and product equipped with metal filmMORI KUNIO·Filed 2014·Granted Mar 14, 2017·1 cites·12 claims
- 0754US2025171470A1Compound, bonding agent, bonded body, printed circuit board, and method for manufacturing bonded bodyDAICEL CORP·Filed 2021·Application pending·0 cites
- 0849US9238757B2Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compoundMORI KUNIO·Filed 2011·Granted Jan 19, 2016·0 cites·22 claims
- 0942US2021138763A1Bonded structure and method for producing same, and heat exchangerDENSO CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →