Inventor · disambiguated record
Katsunobu Mori
Also filed as: MORI KATSUNOBU
17 granted patents·6 pending applications·808 citations·filing 1991–2010
95Inventor score
Top patents by PatentIndex Score
23 records- 0193US6118184ASemiconductor device sealed with a sealing resin and including structure to balance sealing resin flowSHARP KK·Filed 1998·Granted Sep 12, 2000·187 cites·12 claims
- 0293US5604379ASemiconductor device having external electrodes formed in concave portions of an anisotropic conductive filmSHARP KK·Filed 1995·Granted Feb 18, 1997·157 cites·6 claims
- 0392US6838748B2Semiconductor element with electromagnetic shielding layer on back/side face(s) thereofSHARP KK·Filed 2003·Granted Jan 4, 2005·70 cites·18 claims
- 0492US6552426B2Semiconductor device and method of manufacturing sameSHARP KK·Filed 2001·Granted Apr 22, 2003·78 cites·9 claims
- 0587US5310699AMethod of manufacturing a bump electrodeSHARP KK·Filed 1992·Granted May 10, 1994·110 cites·12 claims
- 0686US7091616B2Semiconductor device having a leading wiring layerSHARP KK·Filed 2002·Granted Aug 15, 2006·42 cites·16 claims
- 0783US6921980B2Integrated semiconductor circuit including electronic component connected between different component connection portionsSHARP KK·Filed 2002·Granted Jul 26, 2005·36 cites·10 claims
- 0883US6104084ASemiconductor device including a wire pattern for relaying connection between a semiconductor chip and leadsSHARP KK·Filed 1998·Granted Aug 15, 2000·82 cites·42 claims
- 0976US7445958B2Semiconductor device having a leading wiring layerSHARP KK·Filed 2006·Granted Nov 4, 2008·6 cites·17 claims
- 1061US6940175B2Semiconductor device in which a plurality of electronic components are combined with each otherSHARP KK·Filed 2002·Granted Sep 6, 2005·9 cites·10 claims
- 1153US6396157B2Semiconductor integrated circuit device and manufacturing method thereofSHARP KK·Filed 2001·Granted May 28, 2002·6 cites·6 claims
- 1244US6784528B2Semiconductor device with plating wiring connecting IC electrode pad to terminalSHARP KK·Filed 2002·Granted Aug 31, 2004·1 cites·9 claims
- 1343US2005194686A1Semiconductor device and manufacturing method for the sameSHARP KK·Filed 2005·Application pending·0 cites
- 1441US2006163728A1Semiconductor device and method for manufacturing semiconductor deviceSHARP KK·Filed 2006·Application pending·0 cites
- 1541US2002014705A1Semiconductor device and manufacturing method of sameFiled 2001·Application pending·0 cites
- 1641US2005104165A1Semiconductor element, semiconductor device, and method for manufacturing semiconductor elementSHARP KK·Filed 2004·Application pending·0 cites
- 1739US5614760ATape carrier package semiconductor deviceSHARP KK·Filed 1995·Granted Mar 25, 1997·11 cites·12 claims
- 1839US2010294342A1Solar cell module and electronics device including the solar cell moduleNAKANISHI HIROYUKI·Filed 2010·Application pending·0 cites
- 1936US6831002B2Manufacturing method of semiconductor deviceSHARP KK·Filed 2002·Granted Dec 14, 2004·0 cites·23 claims
- 2035US5506444ATape carrier semiconductor deviceSHARP KK·Filed 1994·Granted Apr 9, 1996·8 cites·18 claims
- 2132US5336650AMethod of making tape carrier semiconductor deviceSHARP KK·Filed 1993·Granted Aug 9, 1994·3 cites·2 claims
- 2230US5281848ATape carrier semiconductor deviceSHARP KK·Filed 1991·Granted Jan 25, 1994·2 cites·6 claims
- 2329US2001013643A1Semiconductor integrated circuit deviceFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →