Inventor · disambiguated record
Kanji Murakami
Also filed as: KAWAMOTO MINEO · MURAKAMI KANJI
24 granted patents·1 pending application·674 citations·filing 1976–2016
97Inventor score
Top patents by PatentIndex Score
25 records- 0193US4642161AMethod of bonding copper and resinHITACHI LTD·Filed 1986·Granted Feb 10, 1987·113 cites·11 claims
- 0287US4881122AThree-dimensional shooting video camera apparatusMURAKAMI KANJI·Filed 1988·Granted Nov 14, 1989·60 cites·3 claims
- 0387US4099974AElectroless copper solutionHITACHI LTD·Filed 1976·Granted Jul 11, 1978·35 cites·8 claims
- 0486US4970107AComposite article comprising a copper element and a process for producing itHITACHI LTD·Filed 1989·Granted Nov 13, 1990·50 cites·34 claims
- 0585US4604160AMethod for manufacture of printed wiring boardHITACHI LTD·Filed 1985·Granted Aug 5, 1986·87 cites·18 claims
- 0681US4820549APhoto-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin compositionHITACHI LTD·Filed 1987·Granted Apr 11, 1989·29 cites·3 claims
- 0780US5028513AProcess for producing printed circuit boardHITACHI LTD·Filed 1989·Granted Jul 2, 1991·40 cites·21 claims
- 0880US4151313AMethod for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking materialHITACHI LTD·Filed 1978·Granted Apr 24, 1979·26 cites·7 claims
- 0968US4457952AProcess for producing printed circuit boardsHITACHI LTD·Filed 1983·Granted Jul 3, 1984·24 cites·10 claims
- 1065US4239813AProcess for forming printed wiring by electroless depositionHITACHI LTD·Filed 1979·Granted Dec 16, 1980·16 cites·8 claims
- 1164US4865888AProcess for electroless copper plating and apparatus used thereforHITACHI LTD·Filed 1988·Granted Sep 12, 1989·23 cites·21 claims
- 1260US5403869AAdhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiatorHITACHI CHEMICAL CO LTD·Filed 1993·Granted Apr 4, 1995·17 cites·3 claims
- 1360US4343659AProcess for producing copper barrier type, nuclear fuel claddingHITACHI LTD·Filed 1980·Granted Aug 10, 1982·10 cites·13 claims
- 1459US5584121AProcess for producing multiple wire wiring boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Dec 17, 1996·12 cites·5 claims
- 1559US4632852AProcess for electroless copper platingHITACHI LTD·Filed 1985·Granted Dec 30, 1986·20 cites·31 claims
- 1658US5486655AMultiple wire adhesive on a multiple wire wiring boardHITACHI CHEMICAL CO LTD·Filed 1994·Granted Jan 23, 1996·16 cites·2 claims
- 1757US4378384AProcess for producing printed circuit board by electroless platingHITACHI LTD·Filed 1981·Granted Mar 29, 1983·16 cites·20 claims
- 1856US4876177AProcess for producing printed circuit boardHITACHI LTD·Filed 1987·Granted Oct 24, 1989·17 cites·34 claims
- 1955US6811828B2Electroless gold plating solution and method for electroless platingHITACHI CHEMICAL CO LTD·Filed 2003·Granted Nov 2, 2004·2 cites·20 claims
- 2055US5336132AMultisensation creation apparatus employing stereoscopic imageryMURAKAMI KANJI·Filed 1992·Granted Aug 9, 1994·23 cites·11 claims
- 2153US4610910APrinted circuit board, process for preparing the same and resist ink used thereforHITACHI LTD·Filed 1984·Granted Sep 9, 1986·11 cites·14 claims
- 2249US4838344AAtmosphere control apparatus for theatersMURAKAMI KANJI·Filed 1987·Granted Jun 13, 1989·12 cites·3 claims
- 2346US4919197AAtmosphere control apparatus for theatersMURAKAMI KANJI·Filed 1989·Granted Apr 24, 1990·10 cites·3 claims
- 2438US2017013284A1Transmission signal processing apparatus, transmission signal processing method, and received signal processing apparatusMURAKAMI KANJI·Filed 2016·Application pending·0 cites
- 2534US5139923AMethod for improving adhesion of a resist layer to a metallic layer and electrolessly plating a wiring pattern thereonHITACHI LTD·Filed 1991·Granted Aug 18, 1992·5 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →