Inventor · disambiguated record
Kazuko Nakamura
Also filed as: NAKAMURA KAZUKO
4 granted patents·63 citations·filing 1996–1998
79Inventor score
Top patents by PatentIndex Score
4 records- 0160US5982042ASemiconductor wafer including semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Nov 9, 1999·29 cites·8 claims
- 0249US6105848AWire bonding method, wire bonding apparatus and semiconductor device produced by the sameMITSUBISHI DENKI KABUSHKI KAIS·Filed 1998·Granted Aug 22, 2000·14 cites·6 claims
- 0344US6112969AWire bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Sep 5, 2000·11 cites·1 claims
- 0441US5838071AWire bonding method, wire bonding apparatus and semiconductor device produced by the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 17, 1998·9 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →