Inventor · disambiguated record
Katsumi Nakamura
Also filed as: NAKAMURA KATSUMI
121 granted patents·15 pending applications·3,151 citations·filing 1979–2025
99Inventor score
Files withMITSUBISHI ELECTRIC CORP66CALSONIC KANSEI CORP9KYOCERA CORP8MITSUBISHI HEAVY IND LTD6NAKAMURA KATSUMI6
Top patents by PatentIndex Score
136 records- 0197US6916559B2Ceramic material resistant to halogen plasma and member utilizing the sameKYOCERA CORP·Filed 2002·Granted Jul 12, 2005·401 cites·14 claims
- 0297US6447937B1Ceramic materials resistant to halogen plasma and components using the sameKYOCERA CORP·Filed 1998·Granted Sep 10, 2002·511 cites·7 claims
- 0394US5894149ASemiconductor device having high breakdown voltage and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Apr 13, 1999·128 cites·9 claims
- 0494US4978164AModular vehicle body structureNISSAN MOTOR·Filed 1988·Granted Dec 18, 1990·80 cites·4 claims
- 0593US6218217B1Semiconductor device having high breakdown voltage and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Apr 17, 2001·62 cites·11 claims
- 0693US4900083AModular vehicle body and method of building sameNISSAN MOTOR·Filed 1988·Granted Feb 13, 1990·86 cites·1 claims
- 0792US8686469B2Semiconductor deviceNAKAMURA KATSUMI·Filed 2011·Granted Apr 1, 2014·17 cites·12 claims
- 0890US9427795B2Method for producing a hollow engine valveMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2013·Granted Aug 30, 2016·8 cites·6 claims
- 0990US9287391B2Semiconductor deviceCHEN ZE·Filed 2012·Granted Mar 15, 2016·9 cites·4 claims
- 1090US9041051B2Semiconductor deviceCHEN ZE·Filed 2011·Granted May 26, 2015·11 cites·4 claims
- 1190US7392837B2Integral-type heat exchangerCALSONIC KANSEI CORP·Filed 2006·Granted Jul 1, 2008·10 cites·7 claims
- 1290US5429939ADNA sequences useful for the synthesis of carotenoidsKIRIN BREWERY·Filed 1991·Granted Jul 4, 1995·195 cites·11 claims
- 1390US5134371AMagnetic detection device using an oscillator whose detection element is a magnetoresitance effective elementNIPPON DENSO CO·Filed 1990·Granted Jul 28, 1992·72 cites·38 claims
- 1489US9035434B2Semiconductor device having first and second portions with opposite conductivity type which contact an electrodeNAKAMURA KATSUMI·Filed 2010·Granted May 19, 2015·10 cites·5 claims
- 1589US5783491AMethod of forming a truck MOS gate or a power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jul 21, 1998·85 cites·13 claims
- 1689US5359287AMagnetic detecting circuit having magnetoresistance effective elements oriented in at least two different directionsNIPPON DENSO CO·Filed 1993·Granted Oct 25, 1994·53 cites·19 claims
- 1788US7253031B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Aug 7, 2007·37 cites·4 claims
- 1888US4883309AFront structure for modular vehicle bodyNISSAN MOTOR·Filed 1988·Granted Nov 28, 1989·52 cites·15 claims
- 1987US11949007B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Apr 2, 2024·1 cites·14 claims
- 2087US4770358AAutomatic cutting and winding apparatus for a web-like material such as a filmMITSUBISHI HEAVY IND LTD·Filed 1987·Granted Sep 13, 1988·32 cites·11 claims
- 2186US10026803B1Semiconductor device, power conversion device, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 17, 2018·4 cites·37 claims
- 2286US7108049B2Integral-type heat exchangerCALSONIC KANSEI CORP·Filed 2004·Granted Sep 19, 2006·19 cites·5 claims
- 2386US6953968B2High voltage withstanding semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 11, 2005·33 cites·14 claims
- 2486US6738499B1System for detection of malignancy in pulmonary nodulesARCH DEV CORP·Filed 1999·Granted May 18, 2004·92 cites·24 claims
- 2585US8698195B2Semiconductor deviceOYA DAISUKE·Filed 2011·Granted Apr 15, 2014·12 cites·11 claims
- 2685US4836600AFloor structure for modular vehicle bodyNISSAN MOTOR·Filed 1988·Granted Jun 6, 1989·42 cites·6 claims
- 2784US6815767B2Insulated gate transistorMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 9, 2004·28 cites·16 claims
- 2884US6095239AIntegral-type heat exchangerCALSONIC KANSEI CORP·Filed 1997·Granted Aug 1, 2000·33 cites·3 claims
- 2984US5508534ATrench gate type insulated gate bipolar transistorMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Apr 16, 1996·78 cites·25 claims
- 3084US5444595ALoad drive apparatus including power transistor protection circuit from overcurrentNIPPON DENSO CO·Filed 1994·Granted Aug 22, 1995·51 cites·17 claims
- 3184US5024101APower source circuit and bridge type measuring device with output compensating circuit utilizing the sameNIPPON DENSO CO·Filed 1990·Granted Jun 18, 1991·54 cites·8 claims
- 3283US9601639B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Mar 21, 2017·8 cites·19 claims
- 3383US7115944B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Oct 3, 2006·9 cites·6 claims
- 3483US6173766B1Integrated heat exchangerCALSONIC KANSEI CORP·Filed 1998·Granted Jan 16, 2001·46 cites·7 claims
- 3583US5589581ADNA sequences useful for the synthesis of carotenoidsKIRIN BREWERY·Filed 1994·Granted Dec 31, 1996·24 cites·6 claims
- 3682US6364005B1Integral-type heat exchangerCALSONIC KANSEI CORP·Filed 2000·Granted Apr 2, 2002·16 cites·3 claims
- 3782US5977570ASemiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Nov 2, 1999·41 cites·13 claims
- 3882US2025359094A1Power semiconductor device and method of manufacturing power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3981US9385183B2Semiconductor deviceCHEN ZE·Filed 2012·Granted Jul 5, 2016·6 cites·8 claims
- 4081US8469336B2Valve assemblyNAKAMURA KATSUMI·Filed 2008·Granted Jun 25, 2013·11 cites·5 claims
- 4181US6867437B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Mar 15, 2005·21 cites·3 claims
- 4281US6661054B1Semiconductor device and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 9, 2003·46 cites·3 claims
- 4380US10654138B2Production facility, production facility design method, production facility control method, and manufacturing methodMITSUBISHI HEAVY IND LTD·Filed 2016·Granted May 19, 2020·2 cites·8 claims
- 4480US10026832B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jul 17, 2018·5 cites·15 claims
- 4580US6837304B2Integral-type heat exchangerCALSONIC KANSEI CORP·Filed 2002·Granted Jan 4, 2005·14 cites·3 claims
- 4680US6111290ASemiconductor device having high breakdown voltage and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 29, 2000·46 cites·4 claims
- 4779US10814488B2Assembly body manufacturing device and assembly body manufacturing methodMITSUBISHI HEAVY IND LTD·Filed 2016·Granted Oct 27, 2020·4 cites·11 claims
- 4879US6117734AMethod of forming a trench MOS gate on a power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Sep 12, 2000·41 cites·7 claims
- 4979US5875836AStructure for attaching a fan shroud to a heat exchangerCALSONIC CORP·Filed 1998·Granted Mar 2, 1999·37 cites·8 claims
- 5077US9941269B2Power semiconductor device including well extension region and field-limiting ringsMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 10, 2018·3 cites·11 claims
Showing the top 50 of 136 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →