Inventor · disambiguated record
Kan-Yin Ng
Also filed as: NG KAN-YIN
12 granted patents·2 pending applications·102 citations·filing 2000–2016
90Inventor score
Top patents by PatentIndex Score
14 records- 0191US8182562B2Slurries containing abrasive grains having a unique morphologyDUMM TIMOTHY FRANCIS·Filed 2009·Granted May 22, 2012·13 cites·22 claims
- 0290US7562858B2Wear and texture coatings for components used in manufacturing glass light bulbsDIAMOND INNOVATIONS INC·Filed 2006·Granted Jul 21, 2009·13 cites·13 claims
- 0387US8927101B2Abrasive particles having a unique morphologyDUMM TIMOTHY FRANCIS·Filed 2009·Granted Jan 6, 2015·6 cites·20 claims
- 0486US9982176B2Abrasive particles having a unique morphologyDIAMOND INNOVATIONS INC·Filed 2013·Granted May 29, 2018·2 cites·13 claims
- 0584US8652226B2Abrasive particles having a unique morphologyDUMM TIMOTHY FRANCIS·Filed 2009·Granted Feb 18, 2014·9 cites·6 claims
- 0682US6257954B1Apparatus and process for high temperature wafer edge polishingMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Jul 10, 2001·27 cites·23 claims
- 0775US6479386B1Process for reducing surface variations for polished waferMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Nov 12, 2002·22 cites·37 claims
- 0874US9845417B2Abrasive particles having a unique morphologyDIAMOND INNOVATIONS INC·Filed 2014·Granted Dec 19, 2017·1 cites·14 claims
- 0968US9382463B2Abrasive particles having a unique morphologyDIAMOND INNOVATIONS INC·Filed 2014·Granted Jul 5, 2016·0 cites·11 claims
- 1066US9758708B2Abrasive particles having a unique morphologyDIAMOND INNOVATIONS INC·Filed 2016·Granted Sep 12, 2017·0 cites·14 claims
- 1160US6514423B1Method for wafer processingMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Feb 4, 2003·9 cites·16 claims
- 1242US9095914B2Precision wire saw including surface modified diamondDUMM TIMOTHY·Filed 2010·Granted Aug 4, 2015·0 cites·21 claims
- 1338US2012100366A1Wear resistant coatings containing particles having a unique morphologyDUMM TIMOTHY·Filed 2011·Application pending·0 cites
- 1432US2003064902A1Apparatus and process for producing polished semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →