Inventor · disambiguated record
Kazuo Nishiyama
Also filed as: NISHIYAMA KAZUO
11 granted patents·7 pending applications·314 citations·filing 1978–2015
92Inventor score
Top patents by PatentIndex Score
18 records- 0189US4611793ALeaf spring assembly for wheel suspensionTOYOTA MOTOR CO LTD·Filed 1984·Granted Sep 16, 1986·55 cites·2 claims
- 0288US6107685ASemiconductor part and fabrication method thereof, and structure and method for mounting semiconductor partSONY CORP·Filed 1999·Granted Aug 22, 2000·112 cites·12 claims
- 0372US4482393AMethod of activating implanted ions by incoherent light beamSONY CORP·Filed 1980·Granted Nov 13, 1984·36 cites·5 claims
- 0471US8224970B2Web-screen sharing system, web-screen sharing terminals, and sharing program thereofNISHIYAMA KAZUO·Filed 2008·Granted Jul 17, 2012·8 cites·8 claims
- 0570US6936525B2Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereofSONY CORP·Filed 2002·Granted Aug 30, 2005·15 cites·11 claims
- 0668US6919227B2Semiconductor part of component mounting, mounting structure and mounting methodSONY CORP·Filed 2002·Granted Jul 19, 2005·13 cites·3 claims
- 0768US6841454B2Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereofSONY CORP·Filed 2002·Granted Jan 11, 2005·14 cites·13 claims
- 0868US4203780AFe Ion implantation into semiconductor substrate for reduced lifetime sensitivity to temperatureSONY CORP·Filed 1978·Granted May 20, 1980·22 cites·8 claims
- 0967US4912368ACold cathode discharge tube with series connected capacitorSTANLEY ELECTRIC CO LTD·Filed 1988·Granted Mar 27, 1990·16 cites·12 claims
- 1062US11423496B2Information processing device, information processing method, and programSONY CORP·Filed 2015·Granted Aug 23, 2022·2 cites·19 claims
- 1161US6534875B1Semiconductor part for component mounting, mounting structure and mounting methodSONY CORP·Filed 1999·Granted Mar 18, 2003·21 cites·18 claims
- 1244US2005167851A1Semiconductor part for component mounting, mounting structure and mounting methodFiled 2005·Application pending·0 cites
- 1344US2014184915A1Information processing device, information processing method, and programSONY CORP·Filed 2013·Application pending·0 cites
- 1438US2010272251A1Echo removing apparatus, echo removing method, and communication apparatusSONY CORP·Filed 2010·Application pending·0 cites
- 1537US2017140483A1Information processing device, information processing method, and programSONY CORP·Filed 2015·Application pending·0 cites
- 1637US2002011655A1Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereofFiled 2001·Application pending·0 cites
- 1736US2002152610A1Electronic circuit device and method of production of the sameSONY CORP·Filed 2002·Application pending·0 cites
- 1835US2002004288A1Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereofFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →