Inventor · disambiguated record
Kazunori Oda
Also filed as: ODA KAZUNORI
30 granted patents·13 pending applications·91 citations·filing 2004–2025
96Inventor score
Top patents by PatentIndex Score
43 records- 0193US9966517B2LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrateDAINIPPON PRINTING CO LTD·Filed 2015·Granted May 8, 2018·13 cites·12 claims
- 0290US9773960B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2016·Granted Sep 26, 2017·5 cites·5 claims
- 0390US9263315B2LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrateODA KAZUNORI·Filed 2011·Granted Feb 16, 2016·14 cites·12 claims
- 0490US8933548B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsODA KAZUNORI·Filed 2011·Granted Jan 13, 2015·14 cites·12 claims
- 0588US11859913B2Wick sheet for vapor chamber, vapor chamber, and electronic apparatusDAINIPPON PRINTING CO LTD·Filed 2020·Granted Jan 2, 2024·2 cites·29 claims
- 0686US12167571B2Vapor chamber, electronic device, metallic sheet for vapor chamber and manufacturing method of vapor chamberDAINIPPON PRINTING CO LTD·Filed 2018·Granted Dec 10, 2024·2 cites·22 claims
- 0783US2025338441A1Vapor chamber and electronic deviceDAINIPPON PRINTING CO LTD·Filed 2025·Application pending·0 cites
- 0883US2025071941A1Vapor chamber, electronic device, metallic sheet for vapor chamber and manufacturing method of vapor chamberDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0982US9461220B2Resin-attached lead frame, method for manufacturing the same, and lead frameIKENAGA CHIKAO·Filed 2012·Granted Oct 4, 2016·7 cites·18 claims
- 1081US12382610B2Vapor chamber and electronic deviceDAINIPPON PRINTING CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·5 claims
- 1180US11903167B2Vapor chamber with condensate flow paths disposed on wall partsDAINIPPON PRINTING CO LTD·Filed 2019·Granted Feb 13, 2024·2 cites·7 claims
- 1279US9159655B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2014·Granted Oct 13, 2015·3 cites·23 claims
- 1378US8914252B2Device management method, analysis system used therein, maintenance inspection support method, and maintenance inspection support apparatus used thereinFUJIWARA YOSHIYASU·Filed 2006·Granted Dec 16, 2014·5 cites·12 claims
- 1478US8247888B2Semiconductor device and method for manufacturing metallic shielding plateMASUDA MASACHIKA·Filed 2010·Granted Aug 21, 2012·5 cites·13 claims
- 1575US8762105B2Device management method, analysis system used for the device management method, data structure used in management database, and maintenance inspection support apparatus used for the device management methodFUJIWARA YOSHIYASU·Filed 2006·Granted Jun 24, 2014·4 cites·3 claims
- 1673US10101022B2Fluid utilization facility management method and fluid utilization facility management systemTLV CO LTD·Filed 2015·Granted Oct 16, 2018·1 cites·12 claims
- 1769US9214414B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2014·Granted Dec 15, 2015·1 cites·2 claims
- 1868US8494811B2Device management method, analysis system used for the device management method, analysis data structure, and maintenance inspection support apparatus used for the device management methodFUJIWARA YOSHIYASU·Filed 2006·Granted Jul 23, 2013·1 cites·3 claims
- 1968US2025212367A1Wick sheet for vapor chamber, vapor chamber, and electronic apparatusDAINIPPON PRINTING CO LTD·Filed 2025·Application pending·0 cites
- 2065US10928004B2Threshold value calculation system, and threshold value calculation methodTLV CO LTD·Filed 2016·Granted Feb 23, 2021·1 cites·3 claims
- 2164US9887331B2LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrateDAINIPPON PRINTING CO LTD·Filed 2015·Granted Feb 6, 2018·1 cites·8 claims
- 2261US12256520B2Wick sheet for vapor chamber, vapor chamber, and electronic apparatusDAINIPPON PRINTING CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·15 claims
- 2361US9899583B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·20 claims
- 2461US8162380B2Aerodynamic structure for vehicleSUMITANI KEIJI·Filed 2006·Granted Apr 24, 2012·7 cites·28 claims
- 2560US10663162B2Fluid utilization facility management method and fluid utilization facility management systemTLV CO LTD·Filed 2018·Granted May 26, 2020·0 cites·13 claims
- 2660US9553247B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2015·Granted Jan 24, 2017·0 cites·17 claims
- 2759US9412923B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2015·Granted Aug 9, 2016·0 cites·2 claims
- 2859US9362473B2Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elementsDAINIPPON PRINTING CO LTD·Filed 2015·Granted Jun 7, 2016·0 cites·7 claims
- 2958US12032474B2Computer-readable recording medium storing acceleration test program, acceleration test method, and acceleration test apparatusFUJITSU LTD·Filed 2022·Granted Jul 9, 2024·0 cites·7 claims
- 3056US7988220B2Wheel pant device for a vehicle and control method thereofTOYOTA MOTOR CO LTD·Filed 2006·Granted Aug 2, 2011·3 cites·11 claims
- 3154US2025169041A1Vapor chamber body sheet, vapor chamber, and electronic apparatusDAINIPPON PRINTING CO LTD·Filed 2023·Application pending·0 cites
- 3251US9806241B2Resin-attached lead frame and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2016·Granted Oct 31, 2017·0 cites·8 claims
- 3351US2025048591A1Vapor chamber and electronic apparatusDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3450US2025185214A1Vapor chamber, electronic apparatus, and method for manufacturing vapor chamberDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3550US2024125559A1Body sheet for vapor chamber, vapor chamber, and electronic apparatusDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3649US10400085B2Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production methodDAINIPPON PRINTING CO LTD·Filed 2014·Granted Sep 3, 2019·0 cites·19 claims
- 3749US2023118403A1Propylene oxide production apparatus and propylene oxide production methodSUMITOMO CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3848US2024224469A1Vapor chamber, wick sheet for vapor chamber, and electronic apparatusDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3948US2024353182A1Vapor chamber, wick sheet for vapor chamber, and electronic apparatusDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 4047US2024130081A1Main body sheet for vapor chamber, vapor chamber, and electronic apparatusDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 4144US11379801B2Maintenance support system and maintenance support methodTLV CO LTD·Filed 2016·Granted Jul 5, 2022·0 cites·7 claims
- 4237US2006289203A1Double-sided wiring board, double sided wiring board manufacturing method, and multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2004·Application pending·0 cites
- 4336US2015372205A1Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production methodDAINIPPON PRINTING CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →