Inventor · disambiguated record
Kazuo Ogata
Also filed as: OGATA KAZUO
13 granted patents·3 pending applications·76 citations·filing 1974–2022
88Inventor score
Top patents by PatentIndex Score
16 records- 0187US9460982B2Integrated heat spreader for multi-chip packagesINTEL CORP·Filed 2015·Granted Oct 4, 2016·6 cites·18 claims
- 0283US9236323B2Integrated heat spreader for multi-chip packagesINTEL CORP·Filed 2013·Granted Jan 12, 2016·6 cites·7 claims
- 0379US4585357AHomogenizerOGATA KAZUO·Filed 1984·Granted Apr 29, 1986·45 cites·13 claims
- 0463US4153485AProcess for heating steel powder compactsKOBE STEEL LTD·Filed 1977·Granted May 8, 1979·11 cites·13 claims
- 0562US9215346B2Image forming apparatusCANON KK·Filed 2013·Granted Dec 15, 2015·1 cites·19 claims
- 0656US8136244B2Integrated heat spreader and method of fabricationOGATA KAZUO·Filed 2008·Granted Mar 20, 2012·1 cites·12 claims
- 0749US7554198B2Flexible joint methodology to attach a die on an organic substrateINTEL CORP·Filed 2006·Granted Jun 30, 2009·2 cites·19 claims
- 0848US8863383B2Integrated heat spreader and method of fabricationOGATA KAZUO·Filed 2012·Granted Oct 21, 2014·0 cites·16 claims
- 0948US2016372398A1Integrated heat spreader for multi-chip packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 1045US9806408B2Antenna and method for producing the sameSK-ELECTRONICS CO LTD·Filed 2013·Granted Oct 31, 2017·0 cites·8 claims
- 1135US11927122B2Exhaust promotion device, and exhaust system improvement method for internal combustion engineKOKUSHO CO LTD·Filed 2021·Granted Mar 12, 2024·0 cites·16 claims
- 1235US3947721ALiquid crystal deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1974·Granted Mar 30, 1976·4 cites·3 claims
- 1331US2019043778A1Swaging process for complex integrated heat spreadersINTEL CORP·Filed 2015·Application pending·0 cites
- 1428US5612589AColor filter substrate and making method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Mar 18, 1997·0 cites·7 claims
- 1524USD996328SExhaust gas purifier with function to improve fuel consumptionKOKUSHO CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·1 claims
- 1624US2007231970A1Cured mold compound spacer for stacked-die packageFUKUO TSUYOSHI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →