Inventor · disambiguated record
Kana Okada
Also filed as: OKADA KANA
5 granted patents·7 pending applications·5 citations·filing 2011–2023
67Inventor score
Top patents by PatentIndex Score
12 records- 0176US10577323B2Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying compound or resinMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Mar 3, 2020·1 cites·12 claims
- 0272US10364314B2Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 30, 2019·2 cites·21 claims
- 0372US9162431B2Laminate filmMATSUMOTO NOBUHIKO·Filed 2011·Granted Oct 20, 2015·2 cites·8 claims
- 0465US2025361355A1Epoxy resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0562US2025263519A1Epoxy resin curing agent, epoxy resin composition and cured product thereof, fiber-reinforced composite material, and high-pressure gas containerMITSUBISHI GAS CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0662US2024400750A1Epoxy resin composition, cured product thereof, prepreg, fiber-reinforced composite material, and high-pressure gas containerMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0759US2024400751A1Epoxy resin composition, cured product thereof, fiber-reinforced composite material, and high pressure gas containerMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0838US2020166844A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 0937US10359701B2Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 23, 2019·0 cites·15 claims
- 1034US10338471B2Composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Jul 2, 2019·0 cites·11 claims
- 1134US2018101097A1Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
- 1233US2018052392A1Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, and circuit pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kana Okada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →