Inventor · disambiguated record
Kazumasa Okuma
Also filed as: OKUMA KAZUMASA
1 granted patent·2 pending applications·0 citations·filing 2020–2023
10Inventor score
Technology areasH10P
Files withHITACHI HIGH TECH CORP3
Top patents by PatentIndex Score
3 records- 0153US2025201570A1Wafer processing method and wafer processing systemHITACHI HIGH TECH CORP·Filed 2023·Application pending·0 cites
- 0246US11961719B2Vacuum processing methodHITACHI HIGH TECH CORP·Filed 2020·Granted Apr 16, 2024·0 cites·5 claims
- 0344US2025038033A1Semiconductor wafer processing methodHITACHI HIGH TECH CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →