Inventor · disambiguated record
Kang Eu Ong
Also filed as: ONG KANG EU
4 granted patents·4 pending applications·2 citations·filing 2008–2023
62Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0155US8258019B2Flip chip assembly process for ultra thin substrate and package on package assemblyMONG WENG KHOON·Filed 2008·Granted Sep 4, 2012·2 cites·9 claims
- 0253US2025054819A1Stiffener assembly and method for making a semiconductor assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 0351US9397016B2Flip chip assembly process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2014·Granted Jul 19, 2016·0 cites·18 claims
- 0442US10879219B2Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structureINTEL CORP·Filed 2018·Granted Dec 29, 2020·0 cites·19 claims
- 0542US8847368B2Flip chip assembly process for ultra thin substrate and package on package assemblyMONG WENG KHOON·Filed 2012·Granted Sep 30, 2014·0 cites·16 claims
- 0638US2019006294A1Stiffener for a package substrateINTEL CORP·Filed 2018·Application pending·0 cites
- 0730US2012159118A1Lower IC Package Structure for Coupling with an Upper IC Package to Form a Package-On-Package (PoP) Assembly and PoP Assembly Including Such a Lower IC Package StructureWONG SHAW FONG·Filed 2010·Application pending·0 cites
- 0828US2017170108A1Chip carrier having variably-sized padsINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →