Inventor · disambiguated record
Katsuhisa Ookawa
Also filed as: OOKAWA KATSUHISA
1 granted patent·2 pending applications·16 citations·filing 2000–2001
37Inventor score
Files withNEC CORP3
Top patents by PatentIndex Score
3 records- 0171US6428202B1Method for inspecting connection state of electronic part and a substrate, and apparatus for the sameNEC CORP·Filed 2000·Granted Aug 6, 2002·16 cites·5 claims
- 0232US2001036676A1Semiconductor wafer polishing endpoint detecting system and method thereforNEC CORP·Filed 2001·Application pending·0 cites
- 0331US2002013007A1Semiconductor wafer polishing end point detection method and apparatusNEC CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →