Inventor · disambiguated record
Kazuhiro Oshima
Also filed as: OSHIMA KAZUHIRO
27 granted patents·8 pending applications·190 citations·filing 1995–2025
95Inventor score
Files withDENKI KAGAKU KOGYO KK8SHINKO ELECTRIC IND CO8TS TECH CO LTD8OSHIMA KAZUHIRO3KANAI TOMOYUKI2
Top patents by PatentIndex Score
35 records- 0187US8048258B2Resin composition, and temporary fixing method and surface protecting method for members to be processed, by means thereofDENKI KAGAKU KOGYO KK·Filed 2007·Granted Nov 1, 2011·8 cites·9 claims
- 0286US10399470B2Vehicle seatTS TECH CO LTD·Filed 2015·Granted Sep 3, 2019·5 cites·18 claims
- 0386US8859633B2Adherent composition and method of temporarily fixing member therewithOSHIMA KAZUHIRO·Filed 2011·Granted Oct 14, 2014·7 cites·6 claims
- 0486US7829605B2Energy ray-curable resin composition and adhesive using sameDENKI KAGAKU KOGYO KK·Filed 2006·Granted Nov 9, 2010·10 cites·14 claims
- 0584US8415425B2Curable resin composition, surface protection method, temporary fixation method, and separation methodKANAI TOMOYUKI·Filed 2012·Granted Apr 9, 2013·3 cites·18 claims
- 0683US11618356B2Vehicle seatTS TECH CO LTD·Filed 2021·Granted Apr 4, 2023·1 cites·11 claims
- 0782US5497559AMethod of measuring preload clearance in double row rolling bearing and apparatus thereforeNSK LTD·Filed 1995·Granted Mar 12, 1996·41 cites·2 claims
- 0882US2025074274A1Vehicle seatTS TECH CO LTD·Filed 2024·Application pending·0 cites
- 0981US12286042B2Vehicle seatTS TECH CO LTD·Filed 2024·Granted Apr 29, 2025·0 cites·19 claims
- 1081US7988811B2Adhesive composition and method for temporarily fixing member by using the sameDENKI KAGAKU KOGYO KK·Filed 2007·Granted Aug 2, 2011·4 cites·9 claims
- 1179US8313604B2Curable composition and temporary fixation method of member using itOSHIMA KAZUHIRO·Filed 2006·Granted Nov 20, 2012·5 cites·12 claims
- 1278US9538664B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 3, 2017·5 cites·4 claims
- 1378US2025319804A1Headrest and vehicle seat having the same headrestTS TECH CO LTD·Filed 2025·Application pending·0 cites
- 1477US6790461B2Hyaluronic acid gel, method of its production and medical material containing itDENKI KAGAKU KOGYO KK·Filed 2002·Granted Sep 14, 2004·13 cites·16 claims
- 1576US11945347B2Vehicle seatTS TECH CO LTD·Filed 2023·Granted Apr 2, 2024·0 cites·11 claims
- 1676US10398027B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2018·Granted Aug 27, 2019·2 cites·10 claims
- 1774US8338526B2Curable resin composition, surface protection method, temporary fixation method, and separation methodKANAI TOMOYUKI·Filed 2011·Granted Dec 25, 2012·1 cites·14 claims
- 1871US8379402B2Wiring board having lead pin, and lead pinSHINKO ELECTRIC IND CO·Filed 2009·Granted Feb 19, 2013·5 cites·20 claims
- 1970US11152293B2Wiring board having two insulating films and hole penetrating therethroughSHINKO ELECTRIC IND CO·Filed 2019·Granted Oct 19, 2021·1 cites·8 claims
- 2070US11001176B2Vehicle seatTS TECH CO LTD·Filed 2019·Granted May 11, 2021·1 cites·13 claims
- 2169US8410375B2Wiring board and method of manufacturing the sameMATSUSHITA YOSHITAKA·Filed 2008·Granted Apr 2, 2013·5 cites·12 claims
- 2269US6387413B1Hyaluronic acid gel, a method of its production and medical material containing itDENKI KAGAKU KOGYO KK·Filed 1998·Granted May 14, 2002·69 cites·10 claims
- 2365US12337742B2Headrest for a passenger seat of a vehicleTS TECH CO LTD·Filed 2021·Granted Jun 24, 2025·0 cites·19 claims
- 2461US8273827B2Adhesive composition and adhesion methodHISHA YUKI·Filed 2009·Granted Sep 25, 2012·1 cites·20 claims
- 2559US9247646B2Electronic component built-in substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 26, 2016·1 cites·7 claims
- 2658US2008289750A1Curable Resin Composition, Surface Protection Method, Temporary Fixation Method, and Separation MethodDENKI KAGAKU KOGYO KK·Filed 2007·Application pending·0 cites
- 2751US8187411B2Adherent composition and method of temporarily fixing member therewithOSHIMA KAZUHIRO·Filed 2005·Granted May 29, 2012·0 cites·9 claims
- 2848US2009288873A1Wiring board and method of manufacturing the sameSHINKO ELECTRIC INUDUSTRIES CO·Filed 2009·Application pending·0 cites
- 2947US2018047661A1Wiring boardSHINKO ELECTRIC IND CO·Filed 2017·Application pending·0 cites
- 3046US7612127B2Curable resin compositionDENKI KAGAKU KOGYO KK·Filed 2004·Granted Nov 3, 2009·2 cites·20 claims
- 3144US2013248755A1High durability thermally conductive composite and low de-oioling greaseDENKI KAGAKU KOGYO KK·Filed 2013·Application pending·0 cites
- 3244US2011283535A1Wiring board and method of manufacturing the sameHORIUCHI AKIO·Filed 2011·Application pending·0 cites
- 3342US2009211798A1Pga type wiring board and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 3439US8723537B2Probe inspecting method and curable resin compositionNAKAJIMA GOSUKE·Filed 2009·Granted May 13, 2014·0 cites·16 claims
- 3534US9961767B2Circuit board and method of manufacturing circuit boardSHINKO ELECTRIC IND CO·Filed 2016·Granted May 1, 2018·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →