Inventor · disambiguated record
Kazunobu Ota
Also filed as: OTA KAZUNOBU
34 granted patents·8 pending applications·278 citations·filing 1999–2025
97Inventor score
Files withSONY CORP10SONY SEMICONDUCTOR SOLUTIONS CORP10RENESAS ELECTRONICS CORP7RENESAS TECH CORP7MITSUBISHI ELECTRIC CORP4
Top patents by PatentIndex Score
42 records- 0197US9595557B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic deviceSONY CORP·Filed 2016·Granted Mar 14, 2017·10 cites·28 claims
- 0297US9502450B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic deviceYANAGITA TAKESHI·Filed 2012·Granted Nov 22, 2016·18 cites·10 claims
- 0396US9923010B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic deviceSONY CORP·Filed 2017·Granted Mar 20, 2018·10 cites·29 claims
- 0495US10504953B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic deviceSONY CORP·Filed 2019·Granted Dec 10, 2019·7 cites·23 claims
- 0595US10128291B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic deviceSONY CORP·Filed 2017·Granted Nov 13, 2018·8 cites·20 claims
- 0695US7531402B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS TECH CORP·Filed 2007·Granted May 12, 2009·18 cites·1 claims
- 0793US9673235B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic deviceSONY CORP·Filed 2016·Granted Jun 6, 2017·6 cites·22 claims
- 0891US11791368B2Image pickup element, image pickup apparatus, and method of manufacturing image pickup elementSONY CORP·Filed 2020·Granted Oct 17, 2023·2 cites·5 claims
- 0991US10418404B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic deviceSONY CORP·Filed 2018·Granted Sep 17, 2019·4 cites·8 claims
- 1090US7563663B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS TECH CORP·Filed 2007·Granted Jul 21, 2009·9 cites·1 claims
- 1189US8872953B2Solid-state imaging device, manufacturing method thereof, camera, and electronic deviceSAKANO YORITO·Filed 2010·Granted Oct 28, 2014·8 cites·8 claims
- 1289US6436777B1Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 20, 2002·56 cites·18 claims
- 1388US9661194B2Solid-state imaging device, manufacturing method thereof, camera, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2014·Granted May 23, 2017·6 cites·18 claims
- 1487US9887219B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2015·Granted Feb 6, 2018·5 cites·17 claims
- 1586US7220637B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS TECH CORP·Filed 2002·Granted May 22, 2007·20 cites·5 claims
- 1679US10192912B2Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jan 29, 2019·2 cites·16 claims
- 1776US6521963B1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Feb 18, 2003·37 cites·9 claims
- 1875US10332921B2Solid-state image sensing device and method for manufacturing the same, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Jun 25, 2019·2 cites·14 claims
- 1974US8541272B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 24, 2013·1 cites·9 claims
- 2072US7109553B2Semiconductor device and method of manufacturing sameRENESAS TECH CORP·Filed 2004·Granted Sep 19, 2006·14 cites·3 claims
- 2170US6806537B2Semiconductor device having offset insulation film formed on insulation film, and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Oct 19, 2004·13 cites·4 claims
- 2268US10825858B2Image pickup element, image pickup apparatus, and method of manufacturing image pickup elementSONY CORP·Filed 2015·Granted Nov 3, 2020·1 cites·9 claims
- 2364US8987081B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 24, 2015·0 cites·9 claims
- 2463US6248653B1Method of manufacturing gate structureMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jun 19, 2001·11 cites·20 claims
- 2562US8859360B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS ELECTRONICS CORP·Filed 2013·Granted Oct 14, 2014·0 cites·3 claims
- 2662US8642418B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS ELECTRONICS CORP·Filed 2013·Granted Feb 4, 2014·0 cites·8 claims
- 2762US7998802B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 16, 2011·0 cites·2 claims
- 2861US9349816B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS ELECTRONICS CORP·Filed 2015·Granted May 24, 2016·0 cites·14 claims
- 2961US9214464B2Method of manufacturing semiconductor device with offset sidewall structureRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 15, 2015·0 cites·20 claims
- 3059US2025311525A1Imaging Element and Method Of Manufacturing the Same, and Electronic ApparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2025·Application pending·0 cites
- 3157US10306166B2Solid-state imaging device, manufacturing method thereof, camera, and electronic deviceSONY CORP·Filed 2017·Granted May 28, 2019·0 cites·20 claims
- 3257US7170109B2Heterojunction semiconductor device with element isolation structureRENESAS TECH CORP·Filed 2004·Granted Jan 30, 2007·7 cites·3 claims
- 3353US8415213B2Method of manufacturing semiconductor device with offset sidewall structureOTA KAZUNOBU·Filed 2011·Granted Apr 9, 2013·0 cites·19 claims
- 3451US6521517B1Method of fabricating a gate electrode using a second conductive layer as a mask in the formation of an insulating layer by oxidation of a first conductive layerMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 18, 2003·3 cites·10 claims
- 3549US2025006768A1Light-receiving device, x-ray imaging device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 3649US2006273394A1Semiconductor device and method of manufacturing sameRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 3747US2024290814A1Light-receiving device, x-ray imaging device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 3846US2024194701A1Light-receiving element, x-ray imaging element, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 3940US2007131969A1Semiconductor device and method of manufacturing the sameSONY CORP·Filed 2006·Application pending·0 cites
- 4037US8487388B2Solid-state image pickup apparatus, method for manufacturing same, and electronic deviceOTA KAZUNOBU·Filed 2011·Granted Jul 16, 2013·0 cites·12 claims
- 4136US2018240847A1Imaging element and method of manufacturing the same, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Application pending·0 cites
- 4234US2017234995A1Solid-state image sensor, manufacturing method, and radiation imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →