Inventor · disambiguated record
Kang Peng
Also filed as: PENG KANG · PENG KANG-CHIA
2 granted patents·6 pending applications·0 citations·filing 2005–2024
22Inventor score
Files withBEIJING BOE TECHNOLOGY DEV CO LTD3TKD SCIENCE AND TECH CO LTD2BOE TECHNOLOGY GROUP CO LTD1CHUNGHWA PICTURE TUBES LTD1HUAWEI TECH CO LTD1
Top patents by PatentIndex Score
8 records- 0164US2024076725A1Microfluidic substrate, microfluidic chip, methods for preparing and using the chipBEIJING BOE TECHNOLOGY DEV CO LTD·Filed 2022·Application pending·0 cites
- 0259US2025293667A1Wafer-level packaged resonator and preparation method thereof, and electronic equipmentTKD SCIENCE AND TECH CO LTD·Filed 2024·Application pending·0 cites
- 0358US2025183866A1Wafer-level packaged resonator and preparation method therefor, and electronic deviceTKD SCIENCE AND TECH CO LTD·Filed 2024·Application pending·0 cites
- 0452US2024293828A1Centrifugal structure member of microfluidic chip and centrifugeBEIJING BOE TECHNOLOGY DEV CO LTD·Filed 2021·Application pending·0 cites
- 0546US9411603B2Chip and starting method thereofHUAWEI TECH CO LTD·Filed 2014·Granted Aug 9, 2016·0 cites·12 claims
- 0644US2021094011A1Method for preparing vesicle, hollow nanostructure, and method for preparing the sameBOE TECHNOLOGY GROUP CO LTD·Filed 2020·Application pending·0 cites
- 0744US2024299933A1Microfluidic chip and usage method thereof, and microfluidic systemBEIJING BOE TECHNOLOGY DEV CO LTD·Filed 2022·Application pending·0 cites
- 0837US7666291B2Method for fabricating metal wiresCHUNGHWA PICTURE TUBES LTD·Filed 2005·Granted Feb 23, 2010·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →