Inventor · disambiguated record
Kaladhar Radhakrishnan
Also filed as: RADHAKRISHNAN KALADHAR
54 granted patents·23 pending applications·233 citations·filing 2003–2024
98Inventor score
Top patents by PatentIndex Score
77 records- 0194US9230944B1Techniques and configurations associated with a capductor assemblyINTEL CORP·Filed 2014·Granted Jan 5, 2016·19 cites·24 claims
- 0294US7355836B2Array capacitor for decoupling multiple voltage railsINTEL CORP·Filed 2005·Granted Apr 8, 2008·37 cites·30 claims
- 0393US7636242B2Integrated inductorINTEL CORP·Filed 2006·Granted Dec 22, 2009·29 cites·8 claims
- 0492US12288750B2Conformal power delivery structure for direct chip attach architecturesINTEL CORP·Filed 2021·Granted Apr 29, 2025·2 cites·25 claims
- 0592US12074514B2Two stage multi-input multi-output regulatorINTEL CORP·Filed 2020·Granted Aug 27, 2024·3 cites·21 claims
- 0691US11462463B2Microelectronic assemblies having an integrated voltage regulator chipletINTEL CORP·Filed 2018·Granted Oct 4, 2022·6 cites·12 claims
- 0791US8264846B2Ceramic package substrate with recessed deviceJONES CHRISTOPHER C·Filed 2006·Granted Sep 11, 2012·26 cites·18 claims
- 0889US10056182B2Surface-mount inductor structures for forming one or more inductors with substrate tracesINTEL CORP·Filed 2015·Granted Aug 21, 2018·7 cites·9 claims
- 0986US9753510B2Apparatus and method to reduce power losses in an integrated voltage regulatorINTEL CORP·Filed 2015·Granted Sep 5, 2017·5 cites·20 claims
- 1082US6943294B2Integrating passive components on spacer in stacked diesINTEL CORP·Filed 2003·Granted Sep 13, 2005·39 cites·21 claims
- 1181US11450560B2Microelectronic assemblies having magnetic core inductorsINTEL CORP·Filed 2018·Granted Sep 20, 2022·3 cites·19 claims
- 1280US9911723B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2015·Granted Mar 6, 2018·3 cites·11 claims
- 1378US7667320B2Integrated circuit package with improved power signal connectionINTEL CORP·Filed 2008·Granted Feb 23, 2010·5 cites·3 claims
- 1475US10748842B2Package substrates with magnetic build-up layersINTEL CORP·Filed 2018·Granted Aug 18, 2020·1 cites·17 claims
- 1575US7675160B2Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitorINTEL CORP·Filed 2006·Granted Mar 9, 2010·6 cites·7 claims
- 1674US7463492B2Array capacitors with voids to enable a full-grid socketINTEL CORP·Filed 2007·Granted Dec 9, 2008·6 cites·18 claims
- 1773US11955426B2Package-integrated multi-turn coil embedded in a package magnetic coreINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·15 claims
- 1873US11682613B2Package substrates with magnetic build-up layersINTEL CORP·Filed 2021·Granted Jun 20, 2023·0 cites·16 claims
- 1971US11916006B2Microelectronic assemblies having an integrated voltage regulator chipletINTEL CORP·Filed 2022·Granted Feb 27, 2024·0 cites·7 claims
- 2071US11393751B2Package-integrated multi-turn coil embedded in a package magnetic coreINTEL CORP·Filed 2018·Granted Jul 19, 2022·1 cites·15 claims
- 2170US11081434B2Package substrates with magnetic build-up layersINTEL CORP·Filed 2020·Granted Aug 3, 2021·0 cites·16 claims
- 2270US7687905B2Integrated circuit packages, systems, and methodsINTEL CORP·Filed 2008·Granted Mar 30, 2010·4 cites·6 claims
- 2369US10503227B2Apparatus and method to reduce power losses in an integrated voltage regulatorINTEL CORP·Filed 2017·Granted Dec 10, 2019·1 cites·20 claims
- 2469US10453705B2Multi-voltage apparatus for electronics package including magnetic inductor and capacitor and manufacturing thereofINTEL CORP·Filed 2018·Granted Oct 22, 2019·1 cites·16 claims
- 2569US10340260B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2018·Granted Jul 2, 2019·1 cites·8 claims
- 2668US9526175B2Suspended inductor microelectronic structuresMANUSHAROW MATHEW J·Filed 2012·Granted Dec 20, 2016·2 cites·14 claims
- 2766US11380652B2Multi-level distributed clampsINTEL CORP·Filed 2017·Granted Jul 5, 2022·1 cites·15 claims
- 2865US7692284B2Package using array capacitor coreINTEL CORP·Filed 2005·Granted Apr 6, 2010·3 cites·18 claims
- 2960US11676950B2Via-in-via structure for high density package integrated inductorINTEL CORP·Filed 2017·Granted Jun 13, 2023·0 cites·23 claims
- 3059US7173804B2Array capacitor with IC contacts and applicationsINTEL CORP·Filed 2004·Granted Feb 6, 2007·9 cites·17 claims
- 3158US10741536B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2019·Granted Aug 11, 2020·0 cites·10 claims
- 3258US7183644B2Integrated circuit package with improved power signal connectionINTEL CORP·Filed 2004·Granted Feb 27, 2007·5 cites·3 claims
- 3358US2025201766A1Package architectures having vertically stacked dies and voltage convertersINTEL CORP·Filed 2023·Application pending·0 cites
- 3458US2025210587A1Package architectures having vertically stacked dies and voltage domain stackingINTEL CORP·Filed 2023·Application pending·0 cites
- 3558US2025293137A13d die stack redistribution layer for topside power delivery to backside die metallization in multichip composite devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 3658US2025113503A1Capacitive voltage regulator in integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 3757US2025103074A1Voltage regulator partitioning across stacked dieINTEL CORP·Filed 2023·Application pending·0 cites
- 3857US2023089093A1In-built magnetic inductor schemes for glass core substratesINTEL CORP·Filed 2021·Application pending·0 cites
- 3957US2025105736A1Input-side package inductor-based voltage converterDESAI NACHIKET·Filed 2023·Application pending·0 cites
- 4057US2025105144A1Voltage converter with inductor or transformer between stacked dieINTEL CORP·Filed 2023·Application pending·0 cites
- 4156US12363831B2Backside recess in motherboard with thermally conductive moldINTEL CORP·Filed 2020·Granted Jul 15, 2025·0 cites·20 claims
- 4256US12242290B2Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architecturesINTEL CORP·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 4356US12068684B2Multi-phase switching regulators with hybrid inductors and per phase frequency controlINTEL CORP·Filed 2020·Granted Aug 20, 2024·0 cites·25 claims
- 4456US11830809B2Magnetic structures in integrated circuit package supportsINTEL CORP·Filed 2020·Granted Nov 28, 2023·0 cites·19 claims
- 4555US12334242B2Coreless electronic substrates having embedded inductorsINTEL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·14 claims
- 4655US12308362B2Packaging architecture for disaggregated integrated voltage regulatorsINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·20 claims
- 4755US8373074B2Integrated inductorINTEL CORP·Filed 2009·Granted Feb 12, 2013·0 cites·11 claims
- 4855US2025104911A1Coaxial metal inductor loops and associated methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 4954US7348214B2Integrated circuit package with improved power signal connectionINTEL CORP·Filed 2007·Granted Mar 25, 2008·0 cites·1 claims
- 5054US2024063202A1Package architecture with integrated capacitors in quasi-monolithic chip layersINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 77 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →