Inventor · disambiguated record
Kanayo Sawashi
Also filed as: SAWASHI KANAYO
1 granted patent·2 pending applications·0 citations·filing 2022–2022
4Inventor score
Files withNITTO DENKO CORP3
Top patents by PatentIndex Score
3 records- 0152US2022332083A1Film for metal layer laminate board and metal layer laminate boardNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0246US12185463B2Wiring circuit board and method of producing the sameNITTO DENKO CORP·Filed 2022·Granted Dec 31, 2024·0 cites·6 claims
- 0339US2022386453A1Wiring circuit board and method of producing the sameNITTO DENKO CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →