Inventor · disambiguated record
Kazumitsu Seki
Also filed as: SEKI KAZUMITSU
8 granted patents·2 pending applications·142 citations·filing 2000–2009
86Inventor score
Top patents by PatentIndex Score
10 records- 0189US6593643B1Semiconductor device lead frameSHINKO ELECTRIC IND CO·Filed 2000·Granted Jul 15, 2003·80 cites·8 claims
- 0285US7190057B2Packaging component and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2004·Granted Mar 13, 2007·43 cites·45 claims
- 0366US7329944B2Leadframe for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 12, 2008·4 cites·15 claims
- 0465US7524702B2Conductor substrate, semiconductor device and production method thereofSHINKO ELECTRIC IND CO·Filed 2006·Granted Apr 28, 2009·3 cites·40 claims
- 0557US7301226B2Conductor substrate, semiconductor device and production method thereofSHINKO ELECTRIC IND CO·Filed 2004·Granted Nov 27, 2007·8 cites·21 claims
- 0654US7408248B2Lead frame for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Aug 5, 2008·2 cites·8 claims
- 0750US8304872B2Lead frame, method for manufacturing the same and semiconductor deviceSEKI KAZUMITSU·Filed 2009·Granted Nov 6, 2012·2 cites·14 claims
- 0838US2007272441A1Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor DeviceSHINKO ELECTRIC IND CO·Filed 2005·Application pending·0 cites
- 0936US2004262719A1Lead frame for semiconductor packagesSHINKO ELECTRIC IND CO·Filed 2004·Application pending·0 cites
- 1028US8283759B2Lead frame having outer leads coated with a four layer platingOIDA SEISHI·Filed 2006·Granted Oct 9, 2012·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →