Inventor · disambiguated record
Kazutaka Shibata
Also filed as: SHIBATA KAZUTAKA
78 granted patents·7 pending applications·2,150 citations·filing 1991–2019
99Inventor score
Top patents by PatentIndex Score
85 records- 0198US6391685B1Method of forming through-holes in a wafer and then dicing to form stacked semiconductor devicesROHM CO LTD·Filed 2000·Granted May 21, 2002·105 cites·6 claims
- 0297US6133637ASemiconductor device having a plurality of semiconductor chipsROHM CO LTD·Filed 1998·Granted Oct 17, 2000·283 cites·24 claims
- 0396US6727582B2Semiconductor deviceROHM CO LTD·Filed 2002·Granted Apr 27, 2004·88 cites·8 claims
- 0495US6777787B2Semiconductor device with warp preventing board joined theretoROHM CO LTD·Filed 2001·Granted Aug 17, 2004·117 cites·1 claims
- 0595US6700189B2Resin sealed semiconductor deviceROHM CO LTD·Filed 2001·Granted Mar 2, 2004·94 cites·13 claims
- 0694US6724084B1Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid deviceROHM CO LTD·Filed 2000·Granted Apr 20, 2004·85 cites·8 claims
- 0793US8026591B2Semiconductor device with lead terminals having portions thereof extending obliquelyROHM CO LTD·Filed 2010·Granted Sep 27, 2011·9 cites·31 claims
- 0893US6734556B2Semiconductor device with chip-on-chip construction joined via a low-melting point metal layerROHM CO LTD·Filed 2001·Granted May 11, 2004·68 cites·19 claims
- 0992US7384863B2Semiconductor device and method for manufacturing the sameROHM CO LTD·Filed 2004·Granted Jun 10, 2008·60 cites·3 claims
- 1090US8637976B2Semiconductor device with lead terminals having portions thereof extending obliquelyROHM CO LTD·Filed 2013·Granted Jan 28, 2014·6 cites·31 claims
- 1189US9064855B2Semiconductor device with lead terminals having portions thereof extending obliquelyROHM CO LTD·Filed 2013·Granted Jun 23, 2015·5 cites·31 claims
- 1289US6870248B1Semiconductor chip with external connecting terminalROHM CO LTD·Filed 2000·Granted Mar 22, 2005·39 cites·2 claims
- 1388US9812382B2Semiconductor device with lead terminals having portions thereof extending obliquelyROHM CO LTD·Filed 2016·Granted Nov 7, 2017·3 cites·9 claims
- 1488US6462420B2Semiconductor chip and semiconductor device having a chip-on-chip structureROHM CO LTD·Filed 2000·Granted Oct 8, 2002·52 cites·9 claims
- 1587US7339264B2Semiconductor chip with external connecting terminalROHM CO LTD·Filed 2005·Granted Mar 4, 2008·11 cites·7 claims
- 1686US8421209B2Semiconductor device with lead terminals having portions thereof extending obliquelySHIBATA KAZUTAKA·Filed 2011·Granted Apr 16, 2013·6 cites·34 claims
- 1786US7687896B2Semiconductor device having a stacked chip structureROHM CO LTD·Filed 2006·Granted Mar 30, 2010·10 cites·9 claims
- 1886US6376915B1Semiconductor device and semiconductor chipROHM CO LTD·Filed 2000·Granted Apr 23, 2002·43 cites·6 claims
- 1985US10388595B2Semiconductor device with lead terminals having portions thereof extending obliquelyROHM CO LTD·Filed 2017·Granted Aug 20, 2019·2 cites·29 claims
- 2085US7129110B1Semiconductor device and method for manufacturing the sameROHM CO LTD·Filed 2000·Granted Oct 31, 2006·41 cites·11 claims
- 2185US6458609B1Semiconductor device and method for manufacturing thereofROHM CO LTD·Filed 2000·Granted Oct 1, 2002·36 cites·7 claims
- 2283US6369407B1Semiconductor deviceROHM CO LTD·Filed 2000·Granted Apr 9, 2002·36 cites·9 claims
- 2382US6627981B2Resin-packaged semiconductor deviceROHM CO LTD·Filed 2001·Granted Sep 30, 2003·33 cites·7 claims
- 2481US6710431B2Semiconductor device and lead frame used thereforROHM CO LTD·Filed 2001·Granted Mar 23, 2004·17 cites·12 claims
- 2581US6204564B1Semiconductor device and method for making the sameROHM CO LTD·Filed 1998·Granted Mar 20, 2001·63 cites·16 claims
- 2680US7045900B2Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid deviceROHM CO LTD·Filed 2004·Granted May 16, 2006·26 cites·3 claims
- 2780US6967396B1Semiconductor deviceROHM CO LTD·Filed 2003·Granted Nov 22, 2005·24 cites·13 claims
- 2880US6936499B2Semiconductor device and fabrication process thereforROHM CO LTD·Filed 2003·Granted Aug 30, 2005·24 cites·6 claims
- 2980US6593652B2Semiconductor device reinforced by a highly elastic member made of a synthetic resinROHM CO LTD·Filed 2002·Granted Jul 15, 2003·28 cites·4 claims
- 3079US7285446B2Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor deviceROHM CO LTD·Filed 2005·Granted Oct 23, 2007·7 cites·3 claims
- 3179US7247518B2Semiconductor device and method for manufacturing sameROHM CO LTD·Filed 2003·Granted Jul 24, 2007·22 cites·11 claims
- 3279US6815829B2Semiconductor device with compact packageROHM CO LTD·Filed 2001·Granted Nov 9, 2004·27 cites·16 claims
- 3378US6399419B1Production of semiconductor deviceROHM CO LTD·Filed 2000·Granted Jun 4, 2002·22 cites·5 claims
- 3477US6461890B1Structure of semiconductor chip suitable for chip-on-board system and methods of fabricating and mounting the sameROHM CO LTD·Filed 1999·Granted Oct 8, 2002·49 cites·8 claims
- 3576US7705444B2Semiconductor device with lead frame having lead terminals with wide portions of trapezoidal cross sectionROHM CO LTD·Filed 2004·Granted Apr 27, 2010·12 cites·10 claims
- 3676US7358618B2Semiconductor device and manufacturing method thereofROHM CO LTD·Filed 2003·Granted Apr 15, 2008·17 cites·5 claims
- 3776US5762744AMethod of producing a semiconductor device using an expand tapeROHM CO LTD·Filed 1997·Granted Jun 9, 1998·49 cites·1 claims
- 3875US6586832B2Semiconductor device and fabrication process thereofROHM CO LTD·Filed 2001·Granted Jul 1, 2003·18 cites·6 claims
- 3974US6867501B2Semiconductor device and method for manufacturing sameROHM CO LTD·Filed 2002·Granted Mar 15, 2005·17 cites·4 claims
- 4073US7057294B2Semiconductor deviceROHM CO LTD·Filed 2002·Granted Jun 6, 2006·19 cites·8 claims
- 4173US6818550B2Method of cutting a wafer into individual chipsROHM CO LTD·Filed 2002·Granted Nov 16, 2004·16 cites·9 claims
- 4272US5666003APackaged semiconductor device incorporating heat sink plateROHM CO LTD·Filed 1995·Granted Sep 9, 1997·53 cites·8 claims
- 4370US7091591B2Semiconductor deviceROHM CO LTD·Filed 2004·Granted Aug 15, 2006·11 cites·4 claims
- 4470US6781247B2Semiconductor deviceROHM CO LTD·Filed 2002·Granted Aug 24, 2004·16 cites·6 claims
- 4569US10886204B2Semiconductor device with lead terminals having portions thereof extending obliquelyROHM CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·12 claims
- 4669US6696347B1Production process for semiconductor deviceROHM CO LTD·Filed 2000·Granted Feb 24, 2004·14 cites·4 claims
- 4769US6635962B2Chip on chip semiconductor deviceROHM CO LTD·Filed 2001·Granted Oct 21, 2003·16 cites·8 claims
- 4869US5757082ASemiconductor chips, devices incorporating same and method of making sameROHM CO LTD·Filed 1996·Granted May 26, 1998·37 cites·2 claims
- 4968US5471097AResin encapsulated semiconductor device with an electrically insulating support and distortion preventing memberROHM CO LTD·Filed 1994·Granted Nov 28, 1995·38 cites·5 claims
- 5068US5316853AExpand tapeROHM CO LTD·Filed 1991·Granted May 31, 1994·36 cites·2 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Kazutaka Shibata files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →