Inventor · disambiguated record
Kanji Shimoohsako
Also filed as: SHIMOOHSAKO KANJI
3 granted patents·2 pending applications·7 citations·filing 2004–2008
56Inventor score
Top patents by PatentIndex Score
5 records- 0168US7521511B2Thermosetting resin composition, multilayer body using same, and circuit boardKANEKA CORP·Filed 2004·Granted Apr 21, 2009·7 cites·25 claims
- 0254US8501874B2Thermosetting resin composition, multilayer body using same, and circuit boardTANAKA SHIGERU·Filed 2008·Granted Aug 6, 2013·0 cites·17 claims
- 0353US8067523B2Thermosetting resin composition, laminated body using it, and circuit boardTANAKA SHIGERU·Filed 2006·Granted Nov 29, 2011·0 cites·12 claims
- 0448US2010266850A1Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit boardSHIMOOHSAKO KANJI·Filed 2008·Application pending·0 cites
- 0539US2007269665A1Polyimide Resin Composition, Polymer Film Containing Polymide Resin and Laminate Using the Same, and Method for Manufacturing Printed Wiring BoardKANEKA CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →