Inventor · disambiguated record
Kam-Tou Sio
Also filed as: SIO KAM-TOU
116 granted patents·34 pending applications·439 citations·filing 2012–2025
99Inventor score
Top patents by PatentIndex Score
150 records- 0199US11545491B2Fin field-effect transistor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·5 cites·20 claims
- 0299US11282829B2Integrated circuit with mixed row heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·16 cites·20 claims
- 0398US11862623B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 2, 2024·3 cites·20 claims
- 0498US11158580B2Semiconductor devices with backside power distribution network and frontside through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 26, 2021·27 cites·20 claims
- 0598US10700207B2Semiconductor device integrating backside power grid and related integrated circuit and fabrication methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·46 cites·20 claims
- 0697US11532751B2Metal rail conductors for non-planar semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·3 cites·20 claims
- 0796US12148754B2Integrated circuit structure with hybrid cell designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·2 cites·20 claims
- 0896US11765878B2Semiconductor device including a layer between a source/drain region and a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
- 0996US11735517B2Integrated circuit including super via and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 22, 2023·2 cites·20 claims
- 1096US11222157B2Pin access hybrid cell height designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 1196US9793211B2Dual power structure with connection pinsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·13 cites·20 claims
- 1296US9679994B1High fin cut fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·18 cites·20 claims
- 1395US12107045B2Middle-end-of-line strap for standard cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 1, 2024·1 cites·20 claims
- 1495US12034076B2Semiconductor device integrating backside power grid and related integrated circuit and fabrication methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·2 cites·20 claims
- 1595US11842967B2Semiconductor devices with backside power distribution network and frontside through silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 1695US11688730B2Method and system of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·2 cites·20 claims
- 1795US10769342B2Pin access hybrid cell height designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·8 cites·20 claims
- 1895US8698205B2Integrated circuit layout having mixed track standard cellTZENG JIANN-TYNG·Filed 2012·Granted Apr 15, 2014·140 cites·20 claims
- 1994US11942413B2Decoupling capacitors with back side power railsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·2 cites·20 claims
- 2094US10177133B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 8, 2019·8 cites·20 claims
- 2193US11581300B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·2 cites·20 claims
- 2293US11532553B2Middle-end-of-line strap for standard cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 2393US9911697B2Power strap structure for high performance and low current densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·8 cites·20 claims
- 2493US9478636B2Method of forming semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 25, 2016·16 cites·20 claims
- 2592US11663389B2Circuit layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 30, 2023·2 cites·20 claims
- 2692US10804402B2Metal rail conductors for non-planar semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·4 cites·20 claims
- 2792US10366200B2System for and method of manufacturing a layout design of an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 30, 2019·8 cites·20 claims
- 2892US2025366213A1Integrated circuit and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2991US10467374B2System and method for calculating cell edge leakageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·6 cites·20 claims
- 3091US9837353B2Middle end-of-line strap for standard cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·5 cites·20 claims
- 3190US11769766B2Integrated circuit with mixed row heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·1 cites·20 claims
- 3290US11121256B2Semiconductor device integrating backside power grid and related integrated circuit and fabrication methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·2 cites·20 claims
- 3390US10388644B2Method of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 20, 2019·4 cites·20 claims
- 3490US2025344497A1Semiconductor device having nanosheetsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3589US11152348B2Integrated circuit with mixed row heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 19, 2021·6 cites·20 claims
- 3689US10157922B2Interconnect metal layout for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·6 cites·20 claims
- 3789US9917050B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 13, 2018·6 cites·20 claims
- 3889US2025318271A1Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3989US2024387369A1Middle-end-of-line strap for standard cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4088US10510688B2Via rail solution for high power electromigrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·4 cites·20 claims
- 4188US10276499B2Dual power structure with connection pinsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·4 cites·20 claims
- 4288US10170422B2Power strap structure for high performance and low current densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 1, 2019·4 cites·20 claims
- 4388US10096522B2Dummy MOL removal for performance enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 9, 2018·4 cites·20 claims
- 4487US11270936B2Integrated circuit including supervia and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 8, 2022·3 cites·20 claims
- 4587US10977421B2System for and method of manufacturing an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 13, 2021·2 cites·20 claims
- 4687US2025311414A1Multiple back side/buried power rail (bpr) cell including field-effect transistor with air void between two adjacent bpr cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4787US2024322042A1Semiconductor device integrating backside power grid and related integrated circuit and fabrication methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4886US12396255B2Multiple back side/buried power rail (BPR) cell including field-effect transistors with air void between two adjacent BPR cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 4986US12336296B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 5086US10978439B2Method and system of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
Showing the top 50 of 150 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →