Inventor · disambiguated record
Katuo Sugawara
Also filed as: SUGAWARA KATUO
19 granted patents·344 citations·filing 1975–1993
95Inventor score
Files withHITACHI LTD19
Top patents by PatentIndex Score
19 records- 0187US4070416ANovel thermosetting resin and a process for producing sameHITACHI LTD·Filed 1975·Granted Jan 24, 1978·39 cites·48 claims
- 0285US4402211ASystem for monitoring abnormality of oil-filled electric devicesHITACHI LTD·Filed 1981·Granted Sep 6, 1983·56 cites·12 claims
- 0383US4710854AHybrid multilayer wiring boardHITACHI LTD·Filed 1987·Granted Dec 1, 1987·46 cites·13 claims
- 0472US4444040AMethod and apparatus for detecting gas components in oil in oil-filled deviceHITACHI LTD·Filed 1982·Granted Apr 24, 1984·29 cites·6 claims
- 0569US4502320AMethod and apparatus for diagnosing oil-filled electric apparatusHITACHI LTD·Filed 1982·Granted Mar 5, 1985·23 cites·25 claims
- 0663US4784917AThermosetting resin composition and laminate and process for the production thereofHITACHI LTD·Filed 1986·Granted Nov 15, 1988·18 cites·8 claims
- 0761US4470832AGas chromatographic apparatusHITACHI LTD·Filed 1983·Granted Sep 11, 1984·20 cites·16 claims
- 0860US5215842APhotosensitive element for electrophotographyHITACHI LTD·Filed 1991·Granted Jun 1, 1993·13 cites·31 claims
- 0956US5416373AElectrically insulated coils and a method of manufacturing thereofHITACHI LTD·Filed 1993·Granted May 16, 1995·24 cites·10 claims
- 1053US4809058AIntegrated circuit deviceHITACHI LTD·Filed 1986·Granted Feb 28, 1989·20 cites·15 claims
- 1152US5065285AMulti-layer circuit board, method of manufacturing the same and application thereofHITACHI LTD·Filed 1990·Granted Nov 12, 1991·16 cites·6 claims
- 1249US5212244AThermosetting resin composition, and prepreg and laminated sheet which use the sameHITACHI LTD·Filed 1991·Granted May 18, 1993·7 cites·1 claims
- 1348US4946734AResin composition for printed circuit board and such board formed by use thereofHITACHI LTD·Filed 1987·Granted Aug 7, 1990·9 cites·4 claims
- 1442US4607094AThermosetting resin composition from aromatic cyanamideHITACHI LTD·Filed 1985·Granted Aug 19, 1986·4 cites·8 claims
- 1536US5041478AResin composition for printed circuit boardHITACHI LTD·Filed 1990·Granted Aug 20, 1991·4 cites·4 claims
- 1635US4931507AComposition comprising poly(p-hydroxystrene) derivative, epoxy-modified polybutadiene and aromatic maleimideHITACHI LTD·Filed 1988·Granted Jun 5, 1990·3 cites·6 claims
- 1735US4738900AThermo-setting, polymerizable composition and wiring boardHITACHI LTD·Filed 1986·Granted Apr 19, 1988·6 cites·14 claims
- 1835US4587162AResin composition and laminate produced therefrom comprising a cyclized polybutadiene and a prepolymer of a isocyanuric or cyanuric acid derivativeHITACHI LTD·Filed 1985·Granted May 6, 1986·4 cites·14 claims
- 1934US5080965APrepreg from poly(p-hydroxystyrene), epoxy-modified polybutadiene and maleimideHITACHI LTD·Filed 1990·Granted Jan 14, 1992·3 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →