Inventor · disambiguated record
Katsunobu Suzuki
Also filed as: SUZUKI KATSUNOBU
15 granted patents·4 pending applications·911 citations·filing 1995–2022
95Inventor score
Files withNEC CORP12NEC ELECTRONICS CORP2PANASONIC IP MAN CO LTD2DENSO CORP1RENESAS ELECTRONICS CORP1
Top patents by PatentIndex Score
19 records- 0196US6028358APackage for a semiconductor device and a semiconductor deviceNEC CORP·Filed 1997·Granted Feb 22, 2000·146 cites·14 claims
- 0295US5866942AMetal base package for a semiconductor deviceNEC CORP·Filed 1996·Granted Feb 2, 1999·234 cites·19 claims
- 0393US5889325ASemiconductor device and method of manufacturing the sameNEC CORP·Filed 1998·Granted Mar 30, 1999·152 cites·16 claims
- 0491US7378745B2Package substrate for a semiconductor device having thermoplastic resin layers and conductive patternsNEC ELECTRONICS CORP·Filed 2005·Granted May 27, 2008·39 cites·21 claims
- 0587US5977633ASemiconductor device with metal base substrate having hollowsNEC CORP·Filed 1998·Granted Nov 2, 1999·90 cites·20 claims
- 0687US5889324APackage for a semiconductor deviceNEC CORP·Filed 1998·Granted Mar 30, 1999·93 cites·7 claims
- 0775US7888808B2System in package integrating a plurality of semiconductor chipsRENESAS ELECTRONICS CORP·Filed 2007·Granted Feb 15, 2011·7 cites·7 claims
- 0874US7323238B2Printed circuit board having colored outer layerDENSO CORP·Filed 2005·Granted Jan 29, 2008·7 cites·14 claims
- 0973US5844307APlastic molded IC package with leads having small flatness fluctuationNEC CORP·Filed 1996·Granted Dec 1, 1998·45 cites·18 claims
- 1068US5600179APackage for packaging a semiconductor device suitable for being connected to a connection object by solderingNEC CORP·Filed 1995·Granted Feb 4, 1997·36 cites·17 claims
- 1155US6379996B1Package for semiconductor chip having thin recess portion and thick plane portionNEC CORP·Filed 1999·Granted Apr 30, 2002·17 cites·15 claims
- 1251US6111311ASemiconductor device and method of forming the sameNEC CORP·Filed 1998·Granted Aug 29, 2000·17 cites·23 claims
- 1347US6150615AEconomical package with built-in end resistor used for semiconductor device and process of fabricationNEC CORP·Filed 1998·Granted Nov 21, 2000·14 cites·13 claims
- 1443US2009140769A1System-in-packageNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 1542US2024349470A1Electromagnetic shield and communications unitPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 1642US2021165183A1Actuator and camera devicePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1739US5811876ASemiconductor device with film carrier package structureNEC CORP·Filed 1996·Granted Sep 22, 1998·8 cites·7 claims
- 1838US2002096750A1Package for semiconductor chip having thin recess portion and thick plane portionFiled 2002·Application pending·0 cites
- 1936US5783426ASemiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the sameNEC CORP·Filed 1995·Granted Jul 21, 1998·6 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →