Inventor · disambiguated record

Ka-Heng The

Also filed as: THE KA HENG

3 granted patents·72 citations·filing 1990–2000

74Inventor score

Technology areasH10W

Files withNAT SEMICONDUCTOR CORP3

Top patents by PatentIndex Score

3 records

0170US6465890B1Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Oct 15, 2002·20 cites·9 claims
0261US5789806ALeadframe including bendable support arms for downsetting a die attach padNAT SEMICONDUCTOR CORP·Filed 1997·Granted Aug 4, 1998·34 cites·10 claims
0341US5057907AMethod and structure for forming vertical semiconductor interconnectionNAT SEMICONDUCTOR CORP·Filed 1990·Granted Oct 15, 1991·18 cites·6 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →