Inventor · disambiguated record
Katsuya Tomizawa
Also filed as: TOMIZAWA KATSUYA
14 granted patents·3 pending applications·12 citations·filing 2013–2022
86Inventor score
Files withMITSUBISHI GAS CHEMICAL CO17
Top patents by PatentIndex Score
17 records- 0191US11195638B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Dec 7, 2021·2 cites·16 claims
- 0287US10676579B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jun 9, 2020·3 cites·16 claims
- 0383US9902851B2Resin composition, prepreg, laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Feb 27, 2018·4 cites·38 claims
- 0482US11702504B2Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Jul 18, 2023·1 cites·16 claims
- 0578US11718708B2Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2022·Granted Aug 8, 2023·0 cites·22 claims
- 0676US11769607B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2021·Granted Sep 26, 2023·0 cites·13 claims
- 0774US11499005B2Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Nov 15, 2022·0 cites·31 claims
- 0870US10550228B2Resin composition, prepreg, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Feb 4, 2020·1 cites·25 claims
- 0963US2018197655A1Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
- 1062US10703874B2Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising themMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 7, 2020·1 cites·13 claims
- 1154US2021147614A1Thermosetting composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1248US10292260B2Insulating layer for printed circuit board and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted May 14, 2019·0 cites·18 claims
- 1347US10138393B2Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Nov 27, 2018·0 cites·23 claims
- 1445US10717837B2Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising sameMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 21, 2020·0 cites·15 claims
- 1545US10563029B2Resin composition and prepreg, resin sheet, laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Feb 18, 2020·0 cites·9 claims
- 1643US10815349B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Oct 27, 2020·0 cites·16 claims
- 1738US2018163048A1Method for producing printed circuit board, and resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →