Inventor · disambiguated record
Kao-Tsair Tsai
Also filed as: TSAI KAO-TSAIR
17 granted patents·8 pending applications·79 citations·filing 2000–2025
91Inventor score
Files withWINBOND ELECTRONICS CORP25
Top patents by PatentIndex Score
25 records- 0184US6509137B1Multilayer photoresist process in photolithographyWINBOND ELECTRONICS CORP·Filed 2000·Granted Jan 21, 2003·33 cites·11 claims
- 0283US7598155B1Method of manufacturing an overlay markWINBOND ELECTRONICS CORP·Filed 2008·Granted Oct 6, 2009·11 cites·17 claims
- 0370US8022560B2Overlay markWINBOND ELECTRONICS CORP·Filed 2009·Granted Sep 20, 2011·4 cites·6 claims
- 0467US7223527B2Immersion lithography process, and structure used for the same and patterning processWINBOND ELECTRONICS CORP·Filed 2005·Granted May 29, 2007·4 cites·8 claims
- 0567US6544695B2Photomask set for photolithographic operationWINBOND ELECTRONICS CORP·Filed 2001·Granted Apr 8, 2003·9 cites·15 claims
- 0663US6465160B1Method for preventing side-lobes in photolithographyWINBOND ELECTRONICS CORP·Filed 2000·Granted Oct 15, 2002·7 cites·5 claims
- 0763US2025318116A1Memory device and method of fabricating semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0862US9773842B2Memory devicesWINBOND ELECTRONICS CORP·Filed 2016·Granted Sep 26, 2017·1 cites·20 claims
- 0962US2025006562A1Method for optimizing layout pattern and semiconductor waferWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1056US6413685B1Method of reducing optical proximity effectWINBOND ELECTRONICS CORP·Filed 2000·Granted Jul 2, 2002·7 cites·10 claims
- 1155US2025324587A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1255US2025054807A1Method for reducing wafer edge defectsWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1354US12148627B2Method for forming semiconductor memory structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Nov 19, 2024·0 cites·19 claims
- 1453US12119261B2Semiconductor structure and manufacturing method of the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 15, 2024·0 cites·19 claims
- 1553US11818884B2Method for manufacturing non-volatile memory deviceWINBOND ELECTRONICS CORP·Filed 2021·Granted Nov 14, 2023·0 cites·16 claims
- 1652US6791668B2Semiconductor manufacturing apparatus and methodWINBOND ELECTRONICS CORP·Filed 2002·Granted Sep 14, 2004·3 cites·7 claims
- 1752US2022415783A1Semiconductor device and method forming the sameWINBOND ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1850US11798185B2Image analysis system and image analysis method for obtaining object rangeWINBOND ELECTRONICS CORP·Filed 2021·Granted Oct 24, 2023·0 cites·6 claims
- 1950US10658320B1Semiconductor device including conductive structureWINBOND ELECTRONICS CORP·Filed 2019·Granted May 19, 2020·0 cites·10 claims
- 2049US11990365B2Method for manufacturing semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2021·Granted May 21, 2024·0 cites·13 claims
- 2149US2025089245A1Semiconductor structure and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2248US2025372446A1Semiconductor devices having air gaps and methods for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2346US2024231245A9Semiconductor wafer, processing apparatus for overlay shift and processing method thereofWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2444US10615046B2Methods of forming semiconductor devices with flowable material for better planarization methodWINBOND ELECTRONICS CORP·Filed 2018·Granted Apr 7, 2020·0 cites·19 claims
- 2536US7008729B2Method for fabricating phase mask of photolithography processWINBOND ELECTRONICS CORP·Filed 2002·Granted Mar 7, 2006·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →