Inventor · disambiguated record
Kazutoshi Tsuyutani
Also filed as: TSUYUTANI KAZUTOSHI
11 granted patents·6 pending applications·11 citations·filing 2012–2025
81Inventor score
Top patents by PatentIndex Score
17 records- 0177US8779299B2Electronic component-embeded board and method for manufacturing the sameTSUYUTANI KAZUTOSHI·Filed 2012·Granted Jul 15, 2014·7 cites·18 claims
- 0266US9153553B2IC embedded substrate and method of manufacturing the sameTDK CORP·Filed 2014·Granted Oct 6, 2015·2 cites·18 claims
- 0365US12125754B2Sensor package substrate, sensor module including the same, and electronic component embedded substrateTDK CORP·Filed 2022·Granted Oct 22, 2024·0 cites·16 claims
- 0462US10917974B2Circuit board incorporating electronic component and manufacturing method thereofTDK CORP·Filed 2013·Granted Feb 9, 2021·2 cites·17 claims
- 0558US2024364291A1Circuit board and connector device having the sameTDK CORP·Filed 2024·Application pending·0 cites
- 0655US11462447B2Sensor package substrate, sensor module including the same, and electronic component embedded substrateTDK CORP·Filed 2019·Granted Oct 4, 2022·0 cites·5 claims
- 0753US12240751B2Sensor package substrate, sensor module having the same, and sensor package substrate manufacturing methodTDK CORP·Filed 2020·Granted Mar 4, 2025·0 cites·13 claims
- 0850US2025309566A1Antenna moduleTDK CORP·Filed 2023·Application pending·0 cites
- 0946US9635756B2Circuit board incorporating semiconductor IC and manufacturing method thereofTDK CORP·Filed 2013·Granted Apr 25, 2017·0 cites·20 claims
- 1045US11393761B2Circuit board and its manufacturing methodTDK CORP·Filed 2019·Granted Jul 19, 2022·0 cites·12 claims
- 1145US11053118B2Sensor package substrate and sensor module having the sameTDK CORP·Filed 2019·Granted Jul 6, 2021·0 cites·18 claims
- 1244US11682628B2Semiconductor IC-embedded substrate having heat dissipation structure and its manufacturing methodTDK CORP·Filed 2019·Granted Jun 20, 2023·0 cites·20 claims
- 1342US10515898B2Circuit board incorporating semiconductor IC and manufacturing method thereofTDK CORP·Filed 2018·Granted Dec 24, 2019·0 cites·16 claims
- 1441US2024155765A1Electronic component embedded substrate and manufacturing method thereforTDK CORP·Filed 2022·Application pending·0 cites
- 1540US2025239529A1Semiconductor moduleTDK CORP·Filed 2025·Application pending·0 cites
- 1640US2025239533A1Semiconductor moduleTDK CORP·Filed 2025·Application pending·0 cites
- 1739US2024014112A1Electronic component embedded substrateTDK CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →