Inventor · disambiguated record
Kaori Umezawa
Also filed as: UMEZAWA KAORI
12 granted patents·8 pending applications·149 citations·filing 1996–2023
90Inventor score
Top patents by PatentIndex Score
20 records- 0179US7538047B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted May 26, 2009·9 cites·28 claims
- 0275US5994756ASubstrate having shallow trench isolationTOSHIBA KK·Filed 1996·Granted Nov 30, 1999·56 cites·16 claims
- 0369US6365472B1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 1999·Granted Apr 2, 2002·32 cites·10 claims
- 0468US6963630B2Method for evaluating an SOI substrate, evaluation processor, and method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2003·Granted Nov 8, 2005·13 cites·16 claims
- 0566US11776823B2Substrate processing method and substrate processing apparatusKIOXIA CORP·Filed 2022·Granted Oct 3, 2023·0 cites·14 claims
- 0664US8567420B2Cleaning apparatus for semiconductor waferINUKAI MINAKO·Filed 2009·Granted Oct 29, 2013·3 cites·20 claims
- 0757US11443963B2Substrate processing method and substrate processing apparatusKIOXIA CORP·Filed 2019·Granted Sep 13, 2022·0 cites·12 claims
- 0857US8114755B2Method of manufacturing semiconductor deviceMIZUSHIMA ICHIRO·Filed 2008·Granted Feb 14, 2012·1 cites·20 claims
- 0955US2024096653A1Substrate treatment apparatus and method for treating substrateSHIBAURA MECHATRONICS CORP·Filed 2023·Application pending·0 cites
- 1054US12068244B2Semiconductor device, template, and method of manufacturing templateKIOXIA CORP·Filed 2021·Granted Aug 20, 2024·0 cites·10 claims
- 1154US5998849ASemiconductor device having highly-doped source/drain regions with interior edges in a dislocation-free stateTOSHIBA KK·Filed 1997·Granted Dec 7, 1999·17 cites·6 claims
- 1248US2022082933A1Original plate and method of manufacturing the sameKIOXIA CORP·Filed 2021·Application pending·0 cites
- 1347US6919260B1Method of manufacturing a substrate having shallow trench isolationTOSHIBA KK·Filed 1999·Granted Jul 19, 2005·16 cites·34 claims
- 1444US2008064212A1Method of manufacturing semiconductor deviceOGAWA YOSHIHIRO·Filed 2007·Application pending·0 cites
- 1543US6979866B2Semiconductor device with SOI region and bulk region and method of manufacture thereofTOSHIBA KK·Filed 2003·Granted Dec 27, 2005·2 cites·11 claims
- 1642US2009250431A1Substrate processing apparatus and substrate processing methodINUKAI MINAKO·Filed 2009·Application pending·0 cites
- 1741US2006213538A1Semiconductor cleaning apparatus and semiconductor cleaning methodUMEZAWA KAORI·Filed 2006·Application pending·0 cites
- 1838US2019287794A1Template, method of fabricating template, and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Application pending·0 cites
- 1936US2005186803A1Method of manufacturing semiconductor deviceFiled 2005·Application pending·0 cites
- 2036US2011061684A1Cleaning method for semiconductor waferTOMITA HIROSHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →