Inventor · disambiguated record
Kai-Chiang Wu
Also filed as: WU KAI · WU KAI CHIANG
251 granted patents·155 pending applications·620 citations·filing 2002–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD151CONTEMPORARY AMPEREX TECHNOLOGY CO LTD99CONTEMPORARY AMPEREX TECHNOLOGY HONG KONG LTD53TAIWAN SEMICONDUCTOR MFG17INTEL CORP9
Top patents by PatentIndex Score
406 records- 0198US11631919B2Battery, power consumption device, method and device for preparing a batteryCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2020·Granted Apr 18, 2023·6 cites·20 claims
- 0298US11004799B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 11, 2021·4 cites·20 claims
- 0398US10354964B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·21 cites·20 claims
- 0497US11824005B2Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·2 cites·20 claims
- 0597US9412661B2Method for forming package-on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 9, 2016·50 cites·12 claims
- 0696US11908787B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·2 cites·20 claims
- 0796US11588186B2Battery module, device, and failure handling method for failed battery cellCONTEMPORARY AMPEREX TECHNOLOGY CO LTD·Filed 2021·Granted Feb 21, 2023·3 cites·10 claims
- 0896US10461034B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 29, 2019·12 cites·20 claims
- 0995US11398422B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·3 cites·20 claims
- 1095US11093547B2Data storage based on encoded DNA sequencesINTEL CORP·Filed 2018·Granted Aug 17, 2021·13 cites·24 claims
- 1195US10825773B2Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·8 cites·20 claims
- 1295US10529666B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·10 cites·17 claims
- 1395US10468355B2EMI Shielding structure in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·12 cites·20 claims
- 1494US12021047B2Semiconductor packages having a die, an encapsulant, and a redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 1594US11424197B2Package, package structure with redistributing circuits and antenna elements and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·8 cites·20 claims
- 1694US11315891B2Methods of forming semiconductor packages having a die with an encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 26, 2022·11 cites·20 claims
- 1794US9966321B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·8 cites·20 claims
- 1894US9543373B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·15 cites·20 claims
- 1994US8795523B2Device and method for particle complex handlingSU XING·Filed 2012·Granted Aug 5, 2014·15 cites·21 claims
- 2094US7993525B2Device and method for particle complex handlingINTEL CORP·Filed 2006·Granted Aug 9, 2011·18 cites·26 claims
- 2193US11789936B2Storage engine for hybrid data processingLEMON INC·Filed 2021·Granted Oct 17, 2023·5 cites·20 claims
- 2293US11574857B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 7, 2023·3 cites·20 claims
- 2393US11282779B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·3 cites·20 claims
- 2493US10983005B2Spectroscopic overlay metrologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 20, 2021·6 cites·19 claims
- 2593US10312112B2Integrated fan-out package having multi-band antenna and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·8 cites·20 claims
- 2692US11342269B2Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 2792US8715932B2Nucleic acid sequencingSU XING·Filed 2010·Granted May 6, 2014·14 cites·21 claims
- 2892US8563240B2Nucleic acid sequencing and electronic detectionSU XING·Filed 2008·Granted Oct 22, 2013·12 cites·16 claims
- 2991US11348874B2Semiconductor packages and forming methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 3091US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 3191US9818722B1Package structure and method for manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·7 cites·20 claims
- 3291US2025364272A1Semiconductor device and manufacturing method thereofPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 3390US11264316B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 1, 2022·4 cites·20 claims
- 3490US10971460B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·3 cites·20 claims
- 3590US10043761B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·5 cites·20 claims
- 3690US9159686B2Crack stopper on under-bump metallization layerCHEN YU-FENG·Filed 2012·Granted Oct 13, 2015·11 cites·20 claims
- 3790US8409877B2Enzymatic signal generation and detection of binding complexes in stationary fluidic chipLIU DAVID J·Filed 2006·Granted Apr 2, 2013·16 cites·32 claims
- 3889US10510714B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
- 3989US9659879B1Semiconductor device having a guard ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·7 cites·20 claims
- 4089US9497861B2Methods and apparatus for package with interposersTAIWAN SEMIDONDUCTOR MFG COMPANY LTD·Filed 2012·Granted Nov 15, 2016·10 cites·20 claims
- 4189US8158008B2Device and method for particle complex handlingSU XING·Filed 2011·Granted Apr 17, 2012·5 cites·13 claims
- 4289US2025336852A1Polymer layers embedded with metal pads for heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4388US12322670B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·1 cites·20 claims
- 4488US10950556B2EMI shielding structure in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·4 cites·20 claims
- 4588US10707173B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 7, 2020·3 cites·20 claims
- 4688US10050013B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 14, 2018·5 cites·20 claims
- 4788US9030010B2Packaging devices and methodsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 12, 2015·7 cites·20 claims
- 4888US8901730B2Methods and apparatus for package on package devicesLIU MING-KAI·Filed 2012·Granted Dec 2, 2014·9 cites·20 claims
- 4987US10629539B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 21, 2020·4 cites·19 claims
- 5087US10153240B2Method of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 11, 2018·4 cites·20 claims
Showing the top 50 of 406 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Kai-Chiang Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →