Inventor · disambiguated record
Kameshwar Yadavalli
Also filed as: YADAVALLI KAMESHWAR
8 granted patents·35 citations·filing 2012–2021
81Inventor score
Top patents by PatentIndex Score
8 records- 0194US8912017B2Semiconductor wafer bonding incorporating electrical and optical interconnectsEL-GHOROURY HUSSEIN S·Filed 2012·Granted Dec 16, 2014·24 cites·11 claims
- 0286US9306116B2Semiconductor wafer bonding incorporating electrical and optical interconnectsOSTENDO TECHNOLOGIES INC·Filed 2014·Granted Apr 5, 2016·6 cites·88 claims
- 0377US9978582B2Methods for improving wafer planarity and bonded wafer assemblies made from the methodsOSTENDO TECHNOLOGIES INC·Filed 2016·Granted May 22, 2018·3 cites·20 claims
- 0472US11538963B1III-V light emitting device having low Si—H bonding dielectric layers for improved P-side contact performanceOSTENDO TECHNOLOGIES INC·Filed 2019·Granted Dec 27, 2022·2 cites·20 claims
- 0566US11495714B2Device and method for III-V light emitting micropixel array device having hydrogen diffusion barrier layerOSTENDO TECHNOLOGIES INC·Filed 2021·Granted Nov 8, 2022·0 cites·7 claims
- 0658US11476390B2III-V light emitting device with pixels enabling lower cost through-layer viasOSTENDO TECHNOLOGIES INC·Filed 2021·Granted Oct 18, 2022·0 cites·12 claims
- 0755US11195975B2Device and method for III-V light emitting micropixel array device having hydrogen diffusion barrier layerOSTENDO TECHNOLOGIES INC·Filed 2019·Granted Dec 7, 2021·0 cites·23 claims
- 0839US10373830B2Apparatus and methods to remove unbonded areas within bonded substrates using localized electromagnetic wave annealingOSTENDO TECHNOLOGIES INC·Filed 2017·Granted Aug 6, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →