Inventor · disambiguated record
Katsumi Yamazaki
Also filed as: YAMAZAKI KATSUMI
9 granted patents·1 pending application·136 citations·filing 1988–2015
88Inventor score
Top patents by PatentIndex Score
10 records- 0188US4916901ASwashplate type variable displacement hydraulic deviceHONDA MOTOR CO LTD·Filed 1988·Granted Apr 17, 1990·41 cites·20 claims
- 0286US9485864B2Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing methodSHINKO ELECTRIC IND CO·Filed 2014·Granted Nov 1, 2016·10 cites·3 claims
- 0380US4984161AMethod for controlling automatic transmissionsHONDA MOTOR CO LTD·Filed 1988·Granted Jan 8, 1991·31 cites·28 claims
- 0474US7036214B2Manufacturing method of rigid-flexible printed circuit board and structure thereofDENSO CORP·Filed 2003·Granted May 2, 2006·19 cites·11 claims
- 0573US7438945B2Method of producing multilayer interconnection boardSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 21, 2008·4 cites·5 claims
- 0666US5065578AHydrostatic continously variable transmission with adjustable clutch valveHONDA MOTOR CO LTD·Filed 1989·Granted Nov 19, 1991·18 cites·13 claims
- 0756US7286367B2Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit boardDENSO CORP·Filed 2003·Granted Oct 23, 2007·8 cites·20 claims
- 0855US7183196B2Multilayer interconnection board and production method thereofSHINKO ELECTRIC IND CO·Filed 2004·Granted Feb 27, 2007·5 cites·5 claims
- 0942US2007126108A1External connection structure for semiconductor package, and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 1039US11548142B2Parallel link deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jan 10, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →